ES8G

ES8A thru ES8J ® Features Glass passivated junction chip For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency Glass passivated chip junction High temperature soldering: O 260 C/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-0 SMC / DO-214AB Unit: inch ( mm ) .280 (7.11) .260 (6.60) .012 (.305) .006 (.152) Mechanical Data Cases: Molded plastic Terminals: Pure tin plated, lead free. Polarity: Indicated by cathode band Packing: 12mm tape per EIA STD RS-481 Weight: 0.093 gram .050 (1.27) .030 (0.76) .320 (8.13) .305 (7.75) 103(2. . 62) . 079(2. 00) .008(.203) .002(.051) Rating at 25 O C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Maximum Ratings and Electrical Characteristics Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current See Fig. 1 Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 8.0A Maximum DC Reverse Current o @T A =25 C at Rated DC Blocking Voltage o @ T A =100 C Maximum Reverse Recovery Time ( Note 1 ) Typical Junction Capacitance ( Note 2 ) Maximum Thermal Resistance (Note 3) Operating Temperature Range Storage ...