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DB105

Thinki Semiconductor

(DB101 - DB107) 1.0 AMP.DIP GLASS PASSIVATED BRIDGE RECTIFIERS

DB101 thru DB107 ® Pb Free Plating Product DB101 thru DB107 Pb 1.0 AMP.DIP GLASS PASSIVATED BRIDGE RECTIFIERS Feat...


Thinki Semiconductor

DB105

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Description
DB101 thru DB107 ® Pb Free Plating Product DB101 thru DB107 Pb 1.0 AMP.DIP GLASS PASSIVATED BRIDGE RECTIFIERS Features Glass passivated chip junction Low forward voltage drop DB-1 Unit : inch (mm) .335(8.51) .316(8.05) .315(8.00) .285(7.24) .255(6.5) .245(6.2) Ideal for printed circuit board Case: Molded plastic, DB Epoxy: UL 94V-0 rate flame retardant Terminals: Leads solderable per MIL-STD-202, method 208 guaranteed Mounting position: Any .089(2.5) .086(2.2) Mechanical Data .045(1.14) .035(0.89) .022(0.56) .018(0.46) .185(4.69) .150(3.81) .205(5.2) .195(5.0) .075(1.90) .055(1.39) Absolute Maximum Ratings and Characteristics Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Parameter Symbols DB101 DB102 DB103 DB104 DB105 DB106 DB107 Units VRRM VRMS VDC I(AV) IFSM VF at TA = 25 C at TA = 125 OC O Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at TA = 40 OC Peak Forward Surge Current 8.3 ms Single Half-sine-wave Superimposed on Rated Load (JEDEC Method) Maximum Forward Voltage at 1 A Maximum Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance 1) Typical Thermal Resistance Typical Thermal Resistance 2) 2) 50 35 50 100 70 100 200 140 200 400 280 400 1 50 1.1 5 500 25 40 15 600 420 600 800 560 800 1000 700 1000 .350(...




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