160 CLA
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Vishay BCcomponents
Aluminum Capacitors SMD (Chip), High Temperature, Low Impedance
FEATURES
• Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, lead (Pb)-free reflow solderable • Charge and discharge proof, no peak current limitation
160 CLA 150 °C
• High temperature reflow soldering according to JEDEC J-STD-020 • High temperature proof • Vibration proof, 4-pin version and 6-pin version
Higher temperature 140 CRH 125 °C Lower Z Lower Z Higher IR 146 CTI 125 °C
• AEC-Q200 qualified • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912
150 CRZ 105 °C
APPLICATIONS
Fig. 1
• SMD technology, for high temperature reflow soldering • High temperature environment, high peak load
QUICK REFERENCE DATA
DESCRIPTION Nominal case sizes (L x W x H in mm) Rated capacitance range, CR Tolerance on CR Rated voltage range, UR Category temperature range Endurance test at 150 °C Useful life at 150 °C Useful life at 40 °C 1.8 x lR applied Shelf life at 0 V, 150 °C Based on sectional specification Climatic category IEC 60068 VALUE 12.5 x 12.5 x 13 to 18 x 18 x 21 100 μF to 3300 μF ± 20 % 16 V to 50 V - 55 °C to + 150 °C 1000 h to 1500 h 1250 h to 2000 h 300 000 h to 400 000 h 1000 h IEC 60384-18/CECC 32300 55/150/56
• Automotive, industrial
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• Smoothing, filtering, buffering
MARKING
• Rated capacitance (in μF) • Rated voltage (in V) • Date code, in accordance with IEC 60062 • Black mark or “-” sign indicating the cathode (the anode is identified by bevelled edges) • Code indicating group number (A)
PACKAGING
Supplied in blister tape on reel
Revision: 04-Dec-12
Document Number: 28405 1 For technical questions, contact:
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
datasheet pdf - http://www.DataSheet4U.net/
160 CLA
www.vishay.com
Vishay BCcomponents
SELECTION CHART FOR CR, UR, AND RELEVANT NOMINAL CASE SIZES (L x W x H in mm)
CR (μF) 100 150 220 330 470 680 1000 1500 2200 2700 3300 UR (V) 16 12.5 x 12.5 x 13 12.5 x 12.5 x 13 16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 18 x 18 x 21 25 12.5 x 12.5 x 13 12.5 x 12.5 x 13 16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 35 12.5 x 12.5 x 13 12.5 x 12.5 x 13 16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 50 12.5 x 12.5 x 13 12.5 x 12.5 x 13 12.5 x 12.5 x 16 16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 -
min. 0.4/max. 1.0 (2 x)
4-pin: Ø 12.5 mm
6-pin: ≥ Ø 16 mm
min. 0.4/max. 1.0 (2 x) HMAX. MAX. 0.3 HMAX. MAX. 0.3
25V 2200u L4-H
WMAX. B
35V 1000u 3R-H
D
D
WMAX.
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B
L1MAX.
S
LMAX.
L1MAX. S
LMAX.
Fig. 2 - Dimensional outline
Table 1
DIMENSIONS in millimeters AND MASS
NOMINAL CASE SIZE LxWxH 12.5 x 12.5 x 13 12.5 x 12.5 x 16 16 x 16 x 16 16 x 16 x 21 18 x 18 x 16 18 x 18 x 21 CASE CODE 1213 1216 1616 1621 1816 1821 LMAX. 12.9 12.9 16.6 16.6 19.0 19.0 WMAX. 12.9 12.9 16.6 16.6 19.0 19.0 HMAX. 14.0 16.5 17.5 22.0 17.5 22.0 ØD 12.5 12.5 16.0 16.0 18.0 18.0 BMAX. 1.3 1.3 1.3 1.3 1.3 1.3 S 3.6 3.6 6.5 6.5 6.5 6.5 L1MAX. 14.9 14.9 18.6 18.6 21.0 21.0 MASS (g) 2.9 3.2 5.8 7.1 8.0 9.3
Revision: 04-Dec-12
Document Number: 28405 2 For technical questions, contact:
[email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
datasheet pdf - http://www.DataSheet4U.net/
160 CLA
www.vishay.com
Table 2
Vishay BCcomponents
TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES
NOMINAL CASE SIZE LxWxH 12.5 x 12.5 x 13 12.5 x 12.5 x 16 16 x 16 x 16 16 x 16 x 21 18 x 18 x 16 18 x 18 x 21 CASE CODE 1213 1216 1616 1621 1816 1821 PITCH P1 20 24 28 28 32 32 TAPE WIDTH W 24 32 44 44 44 44 TAPE THICKNESS T2 16.2 18.5 18.9 23.4 18.9 23.4 REEL DIAMETER PACKAGING QUANTITY PER REEL 250 200 150 100 125 100
380 380 380 380 380 380
Note • Detailed tape dimensions see section “PACKAGING”
MOUNTING
The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print layout and/or adjacent components. For recommended soldering pad dimensions, refer to Fig. 3 and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the component during processing. For maximum conditions refer to Fig. 4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. As a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering connections. However, the specified maximum curves should never be exceeded.
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