Document
ESD9B, SZESD9B
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESD9B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium.
www.onsemi.com
Specification Features
• Low Capacitance 15 pF • Low Clamping Voltage • Small Body Outline Dimensions: 0.039″ x 0.024″ (1.0mm x 0.60mm) • Low Body Height: 0.016″ (0.4 mm) • Stand−off Voltage: 3.3 V, 5 V • Low Leakage • Response Time is < 1 ns • IEC61000−4−2 Level 4 ESD Protection • AEC−Q101 Qualified and PPAP Capable • SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• This is a Pb−Free Device
Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact Air
±18
kV
±18
IEC 61000−4−4 (EFT)
40
A
Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
°PD° RqJA TJ, Tstg
TL
300
mW
400
°C/W
−55 to +150 °C
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in.
SOD−923 CASE 514AB
MARKING DIAGRAM
XM
X = Specific Device Code M Date Code
ORDERING INFORMATION
Device
Package
Shipping†
ESD9B3.3ST5G
SOD−923 8000/Tape & Reel (Pb−Free)
ESD9B5.0ST5G
SOD−923 8000/Tape & Reel (Pb−Free)
SZESD9B5.0ST5G SOD−923 8000/Tape & Reel (Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
November, 2017 − Rev. 6
Publication Order Number: ESD9B/D
ESD9B, SZESD9B
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Parameter
IPP VC VRWM IR VBR IT C
Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Capacitance @ VR = 0 V and f = 1.0 MHz
I IPP
VC VBR VRWM IIRT
IIRT
VRWM VBR VC V
IPP Bi−Directional
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
VRWM IR (nA) VBR (V) @ IT
(V) @ VRWM
(Note 2)
IT C (pF)
VC
VC (V) Max Per 8 x 20 ms
(Note 4)
Device
Device Marking Max
Max
Min Max mA Typ
Per IEC61000−4−2
(Note 3)
IPP = 1.