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GS-GB1286433YFYJ-R Dataheets PDF



Part Number GS-GB1286433YFYJ-R
Manufacturers Genda
Logo Genda
Description LCD
Datasheet GS-GB1286433YFYJ-R DatasheetGS-GB1286433YFYJ-R Datasheet (PDF)

GENDA TECHNOLOGY (SHEN ZHEN) LTD Part No. Customer Drawing No. Approved Date : GS-GB1286433YFYJ-C/R :_____________ :_____________ :_____________ :_____________ 2009-3-23 2009-3-23 2009-3-23 Approved:______ Checked:_______ Prepared:______ ADDRESS: Friendship Industrial Building 71 District , Baoan Shenzhen, P.R.China TEL 86-755-2786 5012 FAX 86-755-2786 5217 Free Datasheet http://www.datasheet4u.com/ CONTENTS NO 1 2 3 4 5 6 7 8 9 10 11 COVER CONTENTS GENERAL SPECIFICATIONS PRECAUTION.

  GS-GB1286433YFYJ-R   GS-GB1286433YFYJ-R


Document
GENDA TECHNOLOGY (SHEN ZHEN) LTD Part No. Customer Drawing No. Approved Date : GS-GB1286433YFYJ-C/R :_____________ :_____________ :_____________ :_____________ 2009-3-23 2009-3-23 2009-3-23 Approved:______ Checked:_______ Prepared:______ ADDRESS: Friendship Industrial Building 71 District , Baoan Shenzhen, P.R.China TEL 86-755-2786 5012 FAX 86-755-2786 5217 Free Datasheet http://www.datasheet4u.com/ CONTENTS NO 1 2 3 4 5 6 7 8 9 10 11 COVER CONTENTS GENERAL SPECIFICATIONS PRECAUTIONS FOR LCM OPTICAL DEFINITIONS DIMENSIONAL OUTLINE MECHANICAL DATA ELECTRICAL ABSOLUTE RATING CHIP DEPICTION LED BACKLIGHT ELECTRO-OPTICAL CHARACTERISTIC CHECKING STANDARD ITEM PAGE 1 2 3 3 5 6 6 7 7 22 23 GENDA TECHNOLOGY LTD GS-GB1286433YFYJ-C/R PAGE:2/25 Free Datasheet http://www.datasheet4u.com/ 3. GENERAL SPECIFICATIONS This individual specification is general specifications. 4. PRECAUTIONS FOR LCM 4.1 Precautions in handling LCD Modules (hereinafter LCMs) Genda’s LCMs have been assembled and accurately calibrated before delivery. Please observe the following criteria when handling. A. Do not subject the module to excessive shock. B. Do not modify the tab on the metal holder. C. Do not tamper with the printed circuit board. D. Limit the soldering of the printed circuit board to I/O terminals only. E. Do not touch the zebra strip nor modify its location. 4.2 Static electricity warning Genda’s LCM uses CMOS LSI technology. Therefore, strict measures to avoid static electricity discharge are followed through all processes from manufacturing to shipping. When handling a LCM, take sufficient care to prevent static electricity discharge as you would any CMOS IC. A. Do not take the LCM from its anti-static bag until it’s to be assembled. LCM’s are individually packaged in bags specially treated to resist static electricity. When storing, keep the LCM packed in the original bags, or store them in a container processed to be resistant to static electricity, or in an electric conductive container. B. Always use a ground strap when handling a LCM. Always use a ground strap while working with the module, from the time it is taken out of the anti-static bag until it is assembled. If it is necessary to transfer the LCM, once it has been taken out of the bag, always place it in an electric conductive container. Avoid wearing clothes made of chemical fibers, the use of cotton or conductive treated fiber clothing is recommended. C. Use a no-leak iron for soldering the LCM. The soldering iron to be used for soldering the I/O terminals to the LCM are to be insulated or grounded at the iron tip. D. Always ground electrical apparatuses required for assembly. Electrical apparatuses required to assemble the LCM into a product, i.e. electrical screw drivers, are to be first grounded to avoid transmitting spike noises from the motor. E. Assure that the work bench is properly grounded. GENDA TECHNOLOGY LTD GS-GB1286433YFYJ-C/R PAGE:3/25 Free Datasheet http://www.datasheet4u.com/ F. Peel off the LCM protective film slowly. The module is attached with a film to protect the display surface from contamination, damage, adhesion of flux, etc. Peeling off this film abruptly could cause static electricity to be generated, so peel the tape slowly. G. Pay attention to the humidity in the work area. 50~60% RH is recommended. 4.3 Precautions for the soldering of a LCM The following procedures should be followed when soldering the LCM: A. Solder only to the I/O terminal. B. Use a no leakage soldering iron and pay particular attention to the following: (1) Conditions for soldering I/O terminals Temperature at iron tip: 280 Soldering time: 3~4 sec/terminal Type of solder: Eutectic solder (rosin flux filled) Note: (Avoid using flux, because it could penetrate the module and the module may get contaminated during cleaning.) Peel off protective film after soldering the I/O terminals. By following this procedure, the surface contamination caused by the dispersion of flux while soldering can be avoided. (2) Removing the wiring (When a lead wire, or a connector to the I/O terminal of the module is to be removed, remove it only after the solder at the connection has sufficiently melted since the I/O terminal is a through hole.) If it is forcefully removed, it could cause the terminal to break or peel. The recommended procedure is to use a suction-type solder remover. Caution: do not reheat the I/O terminal more than 3 times. 4.4 Long-term storage If the correct method of storage is not followed, deterioration of the display material (polarizer) and oxidation of the I/O terminal plating may make the process of soldering difficult. Please comply with the following procedure. A. Store in the shipping container. B. If the shipping container is not available, place in anti-static bags and seal the opening. C. Store the modules where they are not subjected to direct sunlight or a fluorescent lamp. D. Store in a temperature range of 0 35 with low relative h.


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