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2N3904 Dataheets PDF



Part Number 2N3904
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description NPN Transistor
Datasheet 2N3904 Datasheet2N3904 Datasheet (PDF)

General Purpose Transistors NPN Silicon 2N3903, 2N3904 Features • Pb−Free Packages are Available* DATA SHEET www.onsemi.com COLLECTOR 3 2 BASE 1 EMITTER MAXIMUM RATINGS Rating Symbol Value Unit Collector −Emitter Voltage Collector −Base Voltage Emitter −Base Voltage Collector Current − Continuous Total Device Dissipation @ TA = 25°C Derate above 25°C VCEO VCBO VEBO IC PD 40 Vdc 60 Vdc 6.0 Vdc 200 mAdc 625 mW 5.0 mW/°C Total Device Dissipation @ TC = 25°C Derate above 25°C PD.

  2N3904   2N3904


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General Purpose Transistors NPN Silicon 2N3903, 2N3904 Features • Pb−Free Packages are Available* DATA SHEET www.onsemi.com COLLECTOR 3 2 BASE 1 EMITTER MAXIMUM RATINGS Rating Symbol Value Unit Collector −Emitter Voltage Collector −Base Voltage Emitter −Base Voltage Collector Current − Continuous Total Device Dissipation @ TA = 25°C Derate above 25°C VCEO VCBO VEBO IC PD 40 Vdc 60 Vdc 6.0 Vdc 200 mAdc 625 mW 5.0 mW/°C Total Device Dissipation @ TC = 25°C Derate above 25°C PD 1.5 W 12 mW/°C Operating and Storage Junction Temperature Range TJ, Tstg −55 to +150 °C THERMAL CHARACTERISTICS (Note 1) Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Indicates Data in addition to JEDEC Requirements. TO−92 CASE 29 STYLE 1 123 STRAIGHT LEAD BULK PACK 1 2 3 BENT LEAD TAPE & REEL AMMO PACK MARKING DIAGRAMS 2N 390x YWWG G x = 3 or 4 Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 1 August, 2021 − Rev. 9 Publication Order Number: 2N3903/D 2N3903, 2N3904 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (Note 2) (IC = 1.0 mAdc, IB = 0) Collector −Base Breakdown Voltage (IC = 10 mAdc, IE = 0) Emitter −Base Breakdown Voltage (IE = 10 mAdc, IC = 0) Base Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc) Collector Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc) ON CHARACTERISTICS DC Current Gain (Note 2) (IC = 0.1 mAdc, VCE = 1.0 Vdc) (IC = 1.0 mAdc, VCE = 1.0 Vdc) (IC = 10 mAdc, VCE = 1.0 Vdc) (IC = 50 mAdc, VCE = 1.0 Vdc) (IC = 100 mAdc, VCE = 1.0 Vdc) 2N3903 2N3904 2N3903 2N3904 2N3903 2N3904 2N3903 2N3904 2N3903 2N3904 Collector −Emitter Saturation Voltage (Note 2) (IC = 10 mAdc, IB = 1.0 mAdc) (IC = 50 mAdc, IB = 5.0 mAdc Base −Emitter Saturation Voltage (Note 2) (IC = 10 mAdc, IB = 1.0 mAdc) (IC = 50 mAdc, IB = 5.0 mAdc) SMALL− SIGNAL CHARACTERISTICS Current −Gain − Bandwidth Product (IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) 2N3903 2N3904 Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz) Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) Input Impedance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 2N3903 2N3904 Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 2N3903 2N3904 Small−Signal Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 2N3903 2N3904 Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) Noise Figure (IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k W, f = 1.0 kHz) 2N3903 2N3904 SWITCHING CHARACTERISTICS Delay Time Rise Time (VCC = 3.0 Vdc, VBE = 0.5 Vdc, IC = 10 mAdc, IB1 = 1.0 mAdc) Storage Time (VCC = 3.0 Vdc, IC = 10 mAdc, IB1 = IB2 = 1.0 mAdc) Fall Time 2. Pulse Test: Pulse Width v 300 ms; Duty Cycle v 2%. 2N3903 2N3904 Symbol V(BR)CEO V(BR)CBO V(BR)EBO IBL ICEX hFE VCE(sat) VBE(sat) fT Cobo Cibo hie hre hfe hoe NF td tr ts tf Min 40 60 6.0 − − 20 40 35 70 50 100 30 60 15 30 − − 0.65 − 250 300 − − 1.0 1.0 0.1 0.5 50 100 1.0 − − − − − − − Max Unit − Vdc − Vdc − Vdc 50 nAdc 50 nAdc − − − − − 150 300 − − − − Vdc 0.2 0.3 Vdc 0.85 0.95 MHz − − 4.0 pF 8.0 pF kW 8.0 10 X 10− 4 5.0 8.0 − 200 400 40 mmhos dB 6.0 5.0 35 ns 35 ns 175 ns 200 50 ns www.onsemi.com 2 2N3903, 2N3904 ORDERING INFORMATION Device 2N3903RLRM Package TO−92 Shipping† 2000 / Ammo Pack 2N3904 TO−92 5000 Units / Bulk 2N3904G TO−92 (Pb−Free) 5000 Units / Bulk 2N3904RLRA TO−92 2000 / Tape & Reel 2N3904RLRAG TO−92 (Pb−Free) 2000 / Tape & Reel 2N3904RLRM TO−92 2000 / Ammo Pack 2N3904RLRMG TO−92 (Pb−Free) 2000 / Ammo Pack 2N3904RLRP TO−92 2000 / Ammo Pack 2N3904RLRPG TO−92 (Pb−Free) 2000 / Ammo Pack 2N3904RL1G TO−92 (Pb−Free) 2000 / Tape & Reel 2N3904ZL1 TO−92 2000 / Ammo Pack 2N3904ZL1G TO−92 (Pb−Free) 2000 / Ammo Pack †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DUTY CYCLE = 2% 300 ns - 0.5 V +10.9 V 10 k < 1 ns +3 V 275 CS < 4 pF* * Total shunt capacitance of test jig and connectors Figure 1. Delay and Rise Time Equivalent Test Circ.


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