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MPXY8300C6U Dataheets PDF



Part Number MPXY8300C6U
Manufacturers Freescale Semiconductor
Logo Freescale Semiconductor
Description Tire Pressure Monitor Sensor
Datasheet MPXY8300C6U DatasheetMPXY8300C6U Datasheet (PDF)

Freescale Semiconductor Product Specification MPXY8300 Rev 4, 05/2009 Tire Pressure Monitor Sensor Product Specification The MPXY8300 Series is a 20-pin sensor for use in applications that monitor tire pressure and temperature. It contains the pressure, temperature and 2-axis accelerometer sensors, a microcontroller, and an RF output all within a single package. The MPXY8300 Series is comprised of the following functions all within the same package. Features • • • • • • Pressure sensor with si.

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Freescale Semiconductor Product Specification MPXY8300 Rev 4, 05/2009 Tire Pressure Monitor Sensor Product Specification The MPXY8300 Series is a 20-pin sensor for use in applications that monitor tire pressure and temperature. It contains the pressure, temperature and 2-axis accelerometer sensors, a microcontroller, and an RF output all within a single package. The MPXY8300 Series is comprised of the following functions all within the same package. Features • • • • • • Pressure sensor with signal interface to ADC10 Temperature sensor with signal interface to ADC10 Z- and X-axis accelerometers with signal interface to ADC10 Voltage reference measured by ADC10 4-channel, 10-bit analog-to-digital converter 8-bit MCU – S08 Core with SIM, interrupt and debug/monitor – 512 RAM – 8K FLASH (in addition to 8K providing factory firmware and trim data) – 32-byte, low power, parameter registers Internal 315/434 MHz RF transmitter – External crystal oscillator – PLL-based output with fractional-n divider – ASK and FSK modulation capability – Programmable data rate generator – Manchester or bi-phase data encoding – 128-bit RF data buffer with RTS/CTS handshake – Direct access to RF transmitter from MCU for unique formats – Supply voltage charge pump to compensate for cold batteries with selectable charge times (30, 60, 120 and 240 msec) Differential input LF detector/decoder 4 GPIO pins with optional pull-ups/pull-downs and wake-up interrupt Real Time Interrupt driven by LFO with interrupt intervals of 8, 16, 32, 64, 128, 256, 512 or 1024 msec Low power wake-up timer and periodic reset driven by LFO Watchdog time-out with selectable times and clock sources 2-channel general purpose timer/PWM module (TPM1) Internal oscillators – MCU bus clock of 0.5, 1, 2 and 4 MHz (1, 2, 4 and 8 MHz HFO) – Charge pump clock of 10 MHz – Low frequency, low power time clock (LFO) with 1 msec period – Medium frequency, LFR decoder and sensor clock (MFO) of 8 μsec period Low voltage detection Normal temperature restart in hardware (over temperature detected by software) MPXY8300 Series TIRE PRESSURE, TEMPERATURE AND ACCELERATION SENSOR • 20-LEAD SOIC CASE 1793-03 Top View PTA5 PTA6 XI XO RVSS RF VRF VCAP AVSS AVDD 1 2 g-Cell 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 N/C N/C BKGD VSS VDD PTA0 PTA1 PTA2 PTA3 RESET • • • • • • • Pressure Port Up Figure 1. Pin Connections • • This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2007 - 2009. All rights reserved. Free Datasheet http://www.datasheet4u.com/ ORDERING INFORMATION MPXY8300 Series Order Numbers MPXY8300A6T1 MPXY8300A6U MPXY8300B6T1 MPXY8300B6U MPXY8300C6T1 MPXY8300C6U Temperature Range -40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 125°C Case No. 1793-03 1793-03 1793-03 1793-03 1793-03 1793-03 Package SOIC-20, Tape and Reel SOIC-20, Rail SOIC-20, Tape and Reel SOIC-20, Rail SOIC-20, Tape and Reel SOIC-20, Rail SECTION 1 GENERAL DESCRIPTION 1.1 Overall Block Diagram The block diagram of the device is shown in Figure 1-1. This diagram covers all the main blocks mentioned above and their main signal interactions. Power management controls and bus control signals are not shown in this block diagram for clarity. 1.2 Multi-Chip Interface The device contains four devices using the best process technology for each. • Microcontroller (MCU) • RF transmitter device (RFX) • Pressure sensing device (P-CHIP) • Z- and X-axis acceleration transducer (g-Cell) As shown in Figure 1-1 the MCU interfaces to the RFX using a standard serial peripheral interface (SPI) which creates a separate data and address bus structure within the RFX. The P-Chip and g-Cell both interface to the MCU. 1.3 System Clock Distribution The various clock sources and their distribution are shown in Figure 1-2. Note that most clock sources and distribution are limited to one device, while the SFO, DX and SPI clocks are connected between devices. All clock sources except the low frequency oscillator, LFO, can be turned off by software control in order to conserve power. The LFO is used for: • Slow periodic wake-up of the MCU (see Section 11) • Slow periodic wake-up of LF receiver (LFR) (see Section 12) MPXY8300 Series 2 Sensors Freescale Semiconductor Free Datasheet http://www.datasheet4u.com/ P-CHIP AVDD PTB6 GP I/O PCI RTI TIMER MCU PRESS SENSOR SIGNAL CONDITION VOUT SFO P-CHIP INTERFACE LFO 1 mSec WAKE-UP TIMER PRESS TRIM REGISTER MODE LVD BKGD HFO 1, 2, 4 or 8 MHz TEMP RESTART TEMP TEMP SENSOR VPR VTP VBG VACC X XZ ACCEL ACCEL INTERFACE MFO OSC ADC10 10-BIT 4-CHAN MFO 4 & 8 μSec MCU CORE S08 VDD VDD 32 Byte PARAMETER REGISTER RAM MEMORY 512 8K USER FLASH MEMORY 8K FIRMWARE MEMORY TPM1 TIMER/PWM 2-CHAN VOLT REG VSS Z BANDGAP REF RESET AVDD AVDD AVSS g-Cell DX XI XO XTAL OSC BIT RATE GEN 128-BIT DATA BUFFER VCO/PLL FRACTL DIVIDE.


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