C333C104K1R5CA7301

MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED Multilayer ceramic capacitors are available in a variety of physical sizes and configurations, including leaded devices and surface mounted chips. Leaded styles include molded and conformally coated parts with axial and radial leads. However, the basic capacitor element is similar for all styles. It is called a chip and consists of formulated dielectric materials which have been cast into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Termination materials and methods vary depending on the intended use. TEMPERATURE CHARACTERISTICS Ceramic dielectric materials can be formulated with Class III: General purpose capacitors, suitable a wide range of characteristics. The EIA standard for for by-pass coupling or other applications in which ceramic dielectric capacitors (RS-198) divides ceramic dielectric losses, high insulation resistance and dielectrics into the following classes: stability of capacitance characteristics are of little or no importance. Class III capacitors are similar to Class Class I: Temperature compensating capacitors, II capacitors except for temperature characteristics, suitab...