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PMPS150-1812 Dataheets PDF



Part Number PMPS150-1812
Manufacturers Protek Devices
Logo Protek Devices
Description Polymer PTC Device
Datasheet PMPS150-1812 DatasheetPMPS150-1812 Datasheet (PDF)

05429 Only One Name Means ProTek’Tion™ PMPS150-1812 polymer ptc device Description Surface mount PTC devices are the preferred over-current protection method for computer, consumer electronic, portable electronics and automotive applications. These devices are suitable for automated assembly and are designed to save on board space. ptc device Features • Over-Current Protection • RoHS & REACH Compliant • Halogen-Free Material • UL Recognized applications • Motherboard USB & IEEE 1394 Pr.

  PMPS150-1812   PMPS150-1812



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05429 Only One Name Means ProTek’Tion™ PMPS150-1812 polymer ptc device Description Surface mount PTC devices are the preferred over-current protection method for computer, consumer electronic, portable electronics and automotive applications. These devices are suitable for automated assembly and are designed to save on board space. ptc device Features • Over-Current Protection • RoHS & REACH Compliant • Halogen-Free Material • UL Recognized applications • Motherboard USB & IEEE 1394 Protection • USB & HDMI Port Protection - Set-Top Boxes, Game Consoles • Battery PCM • Mobile Internet Device (MID) • IC VCC Protection • Optical Electronics • Security Systems • Industrial Controls Mechanical characteristics • Surface Mount Device: Size 1812 • Approximate Weight: 0.0476 grams • Lead-Free • 12mm Tape and Reel Per EIA Standard 481 ELECTRICAL specifications PART NUMBER marking MAXIMUM code HOLDING CURRENT (Note 1) IH Amps 1524 1.50 MINIMUM TRIP CURRENT (Note 2) IT AMPS 3.00 MAXIMUM INTERRUPT VOLTAGE (Note 3) V MAX VOLTS 24 MAXIMUM MAXIUM TYPICAL minimum maximum FAULT TIME-TO-TRIP POWER resistance resistance CURRENT CURRENT DISSIPATION (Note 7) (Note 8) (Note 4) (Note 5) (Note 6) I MAX t trip Pd r min r max AMPS AMPS @ Secs watts ohms ohms 20 8.00A @ 1.50s 0.8 0.040 0.110 PMPS150-1812 1. 2. 3. 4. 5. 6. 7. 8. Notes The maximum current at which the device will not trip at 25°C in still air. The minimum current at which the device will always trip at 25°C in still air. The maximum interrupt voltage the device can withstand without damage at the rated current. The maximum fault current the device can withstand without damage at the rated voltage. The maximum time to trip at the assigned current. The typical amount of power dissipated by the device when in state air environment. The minimum device resistance at 25°C prior to tripping. The maximum device resistance at 25°C measured one hour post reflow. 05429.R0 7/13 Page 1 www.protekdevices.com Free Datasheet http://www.datasheet4u.com/ 05429 Only One Name Means ProTek’Tion™ PMPS150-1812 typical device characteristics TEST PROCEDURES AND REQUIREMENTS TEST Resistance Time to Trip (TTrip) Holding Current (IH) Trip Life Cycle Trip Endurance CONDITIONS In Still Air @ 25°C Specified Current Vmax - In Still Air @ 25°C 30 Minutes at IH - In Still Air @ 25°C Vmax, Imax, 100 Cycles - In Still Air @ 25°C Vmax, 60 Minutes - In Still Air @ 25°C ACCEPTANCE CRITERIA Rmin <= R <= Rmax T <= Max Time to Trip No Trip No Arcing or Burning No Arcing or Burning figure 1 thermal derating curve (Rated Holding Current at Ambient Temperature) 160 140 % of Rated Holding and Trip Current 120 100 80 60 40 -50 -40 -30 -20 -10 0 10 20 30 40 Ambient Temperature - °C 50 60 70 80 90 MAXIMUM AMBIENT OPERATING TEMPERATURES - °C base PART NUMBER PMPS150-1812 T (°C) IH(Max) -40 2.20 -20 1.90 0 1.75 25 1.50 40 1.32 50 1.20 60 1.08 70 0.96 85 0.80 05429.R0 7/13 Page 2 www.protekdevices.com Free Datasheet http://www.datasheet4u.com/ 05429 Only One Name Means ProTek’Tion™ PMPS150-1812 typical device characteristics Soldering parameters Profile features Average Ramp-Up Rate Tsmin to Tp Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) Time Maintained Above: - Temperature (Tm) - Time (tm) Peak Temperature (Tp) Time within 5°C of Tp (tp) Ramp-Down Rate Time 25°C to Tp pb-free assembly 3°C/Second Max 150°C 200°C 60-180 Seconds 217°C 60-150 Seconds Temperature Tp Tp Ramp-Up Tm Critical Zone Tm to Tp 260°C 20-40 Seconds 6°C/Seconds Max 8 Minutes Max tm Tsmax Tsmin ts Preheat Ramp-Down 1. All temperatures refer to topside of the package, measured on the package body surface. 2. Recommended reflow methods: IR, Vapor Phase, Hot Air Oven. 3. Devices are not designed to be wave soldered to the bottom side of the board. 4. Devices can be cleaned using standard industry methods and solvents. 5. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. t 25°C to Peak Time notices The devices are intended for protection against overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions are anticipated. Operation beyond maximum ratings or improper use may result in device damage and possible arcing and flame. WARNING Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. Polymeric thermistors operate by thermal expansion of the conductive polymer. If devices are placed under pressure or installed in space that would prevent thermal expansion, they may not properly protect against fault conditions. Designs must be selected in such a manner that adequate space is maintained over the life of the product. Twisting, bending, or placing the Polymeric thermistors in tension will decrease the ability of the device to protect against electrical faults. No residual fo.


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