Document
05429
Only One Name Means ProTek’Tion™
PMPS150-1812
polymer ptc device Description
Surface mount PTC devices are the preferred over-current protection method for computer, consumer electronic, portable electronics and automotive applications. These devices are suitable for automated assembly and are designed to save on board space.
ptc device Features
• Over-Current Protection • RoHS & REACH Compliant • Halogen-Free Material • UL Recognized
applications
• Motherboard USB & IEEE 1394 Protection • USB & HDMI Port Protection - Set-Top Boxes, Game Consoles • Battery PCM • Mobile Internet Device (MID) • IC VCC Protection • Optical Electronics • Security Systems • Industrial Controls
Mechanical characteristics
• Surface Mount Device: Size 1812 • Approximate Weight: 0.0476 grams • Lead-Free • 12mm Tape and Reel Per EIA Standard 481
ELECTRICAL specifications
PART NUMBER marking MAXIMUM code HOLDING CURRENT (Note 1) IH Amps
1524 1.50
MINIMUM TRIP CURRENT (Note 2) IT AMPS
3.00
MAXIMUM INTERRUPT VOLTAGE (Note 3) V MAX VOLTS
24
MAXIMUM MAXIUM TYPICAL minimum maximum FAULT TIME-TO-TRIP POWER resistance resistance CURRENT CURRENT DISSIPATION (Note 7) (Note 8) (Note 4) (Note 5) (Note 6) I MAX t trip Pd r min r max AMPS AMPS @ Secs watts ohms ohms
20 8.00A @ 1.50s 0.8 0.040 0.110
PMPS150-1812
1. 2. 3. 4. 5. 6. 7. 8.
Notes
The maximum current at which the device will not trip at 25°C in still air. The minimum current at which the device will always trip at 25°C in still air. The maximum interrupt voltage the device can withstand without damage at the rated current. The maximum fault current the device can withstand without damage at the rated voltage. The maximum time to trip at the assigned current. The typical amount of power dissipated by the device when in state air environment. The minimum device resistance at 25°C prior to tripping. The maximum device resistance at 25°C measured one hour post reflow.
05429.R0 7/13
Page 1
www.protekdevices.com
Free Datasheet http://www.datasheet4u.com/
05429
Only One Name Means ProTek’Tion™
PMPS150-1812
typical device characteristics
TEST PROCEDURES AND REQUIREMENTS
TEST
Resistance Time to Trip (TTrip) Holding Current (IH) Trip Life Cycle Trip Endurance
CONDITIONS
In Still Air @ 25°C Specified Current Vmax - In Still Air @ 25°C 30 Minutes at IH - In Still Air @ 25°C Vmax, Imax, 100 Cycles - In Still Air @ 25°C Vmax, 60 Minutes - In Still Air @ 25°C
ACCEPTANCE CRITERIA
Rmin <= R <= Rmax T <= Max Time to Trip No Trip No Arcing or Burning No Arcing or Burning
figure 1 thermal derating curve (Rated Holding Current at Ambient Temperature)
160
140 % of Rated Holding and Trip Current
120
100
80
60
40 -50 -40 -30 -20 -10 0 10 20 30 40 Ambient Temperature - °C 50 60 70 80 90
MAXIMUM AMBIENT OPERATING TEMPERATURES - °C
base PART NUMBER
PMPS150-1812 T (°C) IH(Max) -40 2.20 -20 1.90 0 1.75 25 1.50 40 1.32 50 1.20 60 1.08 70 0.96 85 0.80
05429.R0 7/13
Page 2
www.protekdevices.com
Free Datasheet http://www.datasheet4u.com/
05429
Only One Name Means ProTek’Tion™
PMPS150-1812
typical device characteristics
Soldering parameters
Profile features
Average Ramp-Up Rate Tsmin to Tp Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) Time Maintained Above: - Temperature (Tm) - Time (tm) Peak Temperature (Tp) Time within 5°C of Tp (tp) Ramp-Down Rate Time 25°C to Tp
pb-free assembly
3°C/Second Max
150°C 200°C 60-180 Seconds 217°C 60-150 Seconds
Temperature
Tp Tp Ramp-Up Tm Critical Zone Tm to Tp
260°C 20-40 Seconds 6°C/Seconds Max 8 Minutes Max
tm
Tsmax Tsmin ts Preheat Ramp-Down
1. All temperatures refer to topside of the package, measured on the package body surface. 2. Recommended reflow methods: IR, Vapor Phase, Hot Air Oven. 3. Devices are not designed to be wave soldered to the bottom side of the board. 4. Devices can be cleaned using standard industry methods and solvents. 5. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
t 25°C to Peak
Time
notices
The devices are intended for protection against overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions are anticipated. Operation beyond maximum ratings or improper use may result in device damage and possible arcing and flame.
WARNING
Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. Polymeric thermistors operate by thermal expansion of the conductive polymer. If devices are placed under pressure or installed in space that would prevent thermal expansion, they may not properly protect against fault conditions. Designs must be selected in such a manner that adequate space is maintained over the life of the product. Twisting, bending, or placing the Polymeric thermistors in tension will decrease the ability of the device to protect against electrical faults. No residual fo.