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SEAF8-30-05.0-S-0x

Samtec

ULTRA HIGH DENSITY OPEN PIN FIELD

F-212-1 SEAF8–30–05.0–S–06–2–K–TR (0,80 mm) .0315" SEAF8 SERIES SEAF8–30–05.0–S–04–2–K–TR ULTRA HIGH DENSITY OPEN PI...


Samtec

SEAF8-30-05.0-S-0x

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F-212-1 SEAF8–30–05.0–S–06–2–K–TR (0,80 mm) .0315" SEAF8 SERIES SEAF8–30–05.0–S–04–2–K–TR ULTRA HIGH DENSITY OPEN PIN FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SEAF8 Insulator Material: Black LCP Contact Material: Copper Alloy Operating Temp Range: -55°C to +125°C Plating: Au or Sn over 50µ" (1,27 µm) Ni Working Voltage: 220 VAC RoHS Compliant: Yes Lead-Free Solderable: Yes Mates with: SEAM8 Signal Integrity optimized Edge Rate™ contact Up to 180 I/Os ™ 4 and 6 row ALSO AVAILABLE Other pin counts in design. Call Samtec. Lead-Free Solder Charge Terminations 7 mm and 10 mm Stack Heights www.DataSheet.net/ SEAF8 NO. PINS PER ROW 05.0 PLATING OPTION NO. OF ROWS SOLDER TYPE K TR – TR –S –10, – 20, – 30 (Call Samtec for other sizes) = 30µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail – 04 =Four Rows –2 = Lead-Free Tin Alloy 95.5% Sn/3.8% Ag/0.7%Cu Solder Charge –K = Polyimide film Pick & Place Pad =Tape & Reel – 06 =Six Rows No. of positions x (0,80) .0315 + (5,84) .230 06 NO. OF ROWS –04 A (4,30) .169 (6,30) .248 MATED HEIGHT* SEAF8 LEAD STYLE SEAM8 LEAD STYLE (0,75) .029 01 A –S02.0 (7,00) .276 –S05.0 (10,00) .394 –06 –05.0 *Processing conditions will affect mated height. (1,27) .050 (1,10) (1,32) (1,32) .043 x .052 .052 DIA No. of positions x (0,80) .0315 + (2,56) .101 (4,70) .185 (2,87) .113 (0,80) .0315 Note: Some sizes, styles and options are non-standard, non-returnabl...




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