Document
TB62003,004,006~009P/F/FW
TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB62003P,TB62003F,TB62003FW,TB62004P,TB62004F,TB62004FW,TB62006P TB62006F,TB62006FW,TB62007P,TB62007F,TB62007FW,TB62008P,TB62008F TB62008FW,TB62009P,TB62009F,TB62009FW
8CH DMOS TRANSISTOR ARRAY WITH GATE
TB62003P, TB62003F, TB62003FW INVERTER & DMOS DRIVER
TB62004P, TB62004F, TB62004FW THROUGH & DMOS DRIVER
TB62006P, TB62006F, TB62006FW NAND & DMOS DRIVER
TB62007P, TB62007F, TB62007FW AND & DMOS DRIVER
TB62008P, TB62008F, TB62008FW NOR & DMOS DRIVER
TB62009P, TB62009F, TB62009FW OR & DMOS DRIVER
The TB62003 Series are high−voltage, high−current arrays comprised of eight N−ch DMOS pairs.
FEATURES
l Package
: Type−P DIP−20 pin Type−F SOP−20 pin (200 mil) Type−FW SOL−20 pin (300 mil)
l Output rating : 35 V (Min.) / 200 mA (Max.)
l Low power
Weight DIP20−P−300−2.54 A : 2.25 g (Typ.) SOP20−P−300−1.27 : 0.25 g (Typ.) SOL20−P−300−1.27 : 0.48 g (Typ.)
1 2001-07-04
PIN CONNECTION (TOP VIEW) TB62003P / F / FW
TB62003,004,006~009P/F/FW
TB62004P / F / FW
TB62003P / F / FW
TB62007P / F / FW
TB62008P / F / FW
TB62009P / F / FW
2 2001-07-04
TRUTH TABLE TB62006P / F / FW
I1~4 H H L L X X X X
X: Don’t Care
I5~8 X X X X H H L L
TB62007P / F / FW
I1~4 H H L L X X X X
X: Don’t Care
I5~8 X X X X H H L L
INPUT
CONT1~4 H
L
H
L
X
X
X
X
INPUT
CONT1~4 H
L
H
L
X
X
X
X
TB62003,004,006~009P/F/FW
CONT5~8 X X X X H L H L
O3~4 OFF
OUTPUT O5~8
NOT FIX
ON NOT FIX
ON NOT FIX
ON NOT FIX
NOT FIX
OFF
NOT FIX
ON
NOT FIX
ON
NOT FIX
ON
CONT5~8 X X X X H L H L
O3~4 ON
OUTPUT O5~8
NOT FIX
OFF
NOT FIX
OFF
NOT FIX
OFF
NOT FIX
NOT FIX
ON
NOT FIX
OFF
NOT FIX
OFF
NOT FIX
OFF
3 2001-07-04
TB62008P / F / FW
I1~4 H H L L X X X X
X: Don’t Care
I5~8 X X X X H H L L
TB62009P / F / FW
I1~4 H H L L X X X X
X: Don’t Care
I5~8 X X X X H H L L
INPUT
CONT1~4 H
L
H
L
X
X
X
X
INPUT
CONT1~4 H
L
H
L
X
X
X
X
TB62003,004,006~009P/F/FW
CONT5~8 X X X X H L H L
O3~4 OFF
OUTPUT O5~8
NOT FIX
OFF
NOT FIX
OFF
NOT FIX
ON NOT FIX
NOT FIX
OFF
NOT FIX
OFF
NOT FIX
OFF
NOT FIX
ON
CONT5~8 X X X X H L H L
O3~ 4 ON
OUTPUT O5~8
NOT FIX
ON NOT FIX
ON NOT FIX
OFF
NOT FIX
NOT FIX
ON
NOT FIX
ON
NOT FIX
ON
NOT FIX
OFF
4 2001-07-04
MAXIMUM RATINGS (Ta = 25°C)
TB62003,004,006~009P/F/FW
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage DC Output Voltage DC Output Current DC Input Voltage DC Input Current Input Diode Current Output Diode Current
Power Dissipation
Operating Temperature Storage Temperature
P F FW
VDD VDS IDS VIN IIN IID IOK
PD
Topr Tstg
7 −0.5~35
200 −0.4+VDD+0.4
±5 ±5 5 1.47 0.96 (Note 1) 1.00 (Note 2) −40~85 −55~150
V V mA / ch V mA mA mA
W
°C °C
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%) Note 2: Delated above 25°C in the proportion of 7.7 mW / °C (F Type), 8.0 mW / °C (FW Type).
RECOMMENDED OPERATING CONDITION (Ta = −40~85°C)
CHARACTERISTIC
Supply Voltage Range DC Output Voltage
DC Output Current
DC Input Voltage
P F FW P F FW
SYMBOL
VDD VDS
CONDITION
― ―
Duty 80% IDS
Duty 100%
8ch On VDD = 5.0 V
VIN ―
MIN TYP. MAX UNIT
4.5 ― 5.5 V
― ― 30 V
― ― 170
― ― 90
― ― 140 mA / ― ― 150 ch
― ― 80
― ― 120
GND ―
VDD
V
5 2001-07-04
TB62003,004,006~009P/F/FW
ELECTRICAL CHARACTERISTICS (Ta = 25°C, VDD = 5.0 V)
CHARACTERISTIC Output Leakage Current Low−Level Output Voltage
Output Resistance DC Input Current
SYMBOL IOZ VDS
RON IIN
TEST CIR− CUIT
TEST CONDITION
― VDS = 35 V
― IDS = 150 mA
― IDS = 200 mA
― IDS = 200 mA
― VIN = GND, VIN = VDD
High−Level Input Voltage
Operating Supply Current Output Diode Forward Voltage Turn−On Delay Turn−Off Delay Supply Current Input Capacitance
VIN (H)
VIN (L)
IDDopr
VFK tON tOFF IDD CIN
――
――
―
8ch On, Output open fIN = 1MHz
― IOK = 5 mA
― IOUT = 170 mA
――
――
――
MIN TYP. MAX UNIT
― ― ― ― ―
3.5
−0.4
― 0.70 0.94 4.7 ―
―
―
50 0.8 1.2 6.0 ±1.0 VDD +0.4 1.5
―2―
― 0.6 ― ― 300 ― ― 300 ― ― ― 10 ― 15 ―
µA V Ω µA V
µA V ns µA pF
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
6 2001-07-04
PACKAGE DIMENSIONS
DIP20−P−300−2.54A
TB62003,004,006~009P/F/FW
Unit: mm
Weight: 2.25 g (Typ.)
7 2001-07-04
PACKAGE DIMENSIONS
SOP20−P−300−1.27
TB62003,004,006~009P/F/FW
Unit: mm
Weight: 0.25 g (Typ.)
8 2001-07-04
PACKAGE DIMENSIONS
SOL20−P−300−1.27
TB62003,004,006~009P/F/FW
Unit: mm
Weight: 0.48 g (Typ.)
9 2001-07-04
TB62003,004,006~009P/F/FW
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. N.