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New Product
UH3B, UH3C & UH3D
Vishay General Semiconductor
Surface Mount Ultrafast Rectifier
FEATURES Low profile package Ideal for automated placement Oxide planar chip junction Ultrafast recovery times for high frequency Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Solder dip 260 °C, 40 s
DO-214AB (SMC)
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