ST6G3244ME

www.DataSheet.co.kr ST6G3244ME Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection Features ■ ■ ■ Supports 60 MHz clock rate Supports DDR mode for SD Card™ Compliant with – SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50) – SD Specification Part 1 Physical Layer Specification 2.00 Bi-directional with direction control pin Balanced propagation delays: tPLH ≈ tPHL LDO power-down support. When the LDO is powered down, VCCB is pulled to GND via the 130 Ω resistor. When VCCB = 0 V, there is no additional leakage seen on VCCA. EMI filtering and signal conditioning Supports both 1.8 V and 2.9 V data translation on card side Integrated LDO to supply 1.8 V or 2.9 V power for B-side I/Os (pin-selectable); can be used also externally Integrated pull-up and pull-down resistors on B-side Operating voltage range – VCCA = 1.62 V to 1.98 V – VBAT = 3.0 V to 5.0 V Latch-up performance exceeds 100 mA (JEDEC Standard 78) ESD protection for card side (B-port, CD and WP pins) – ±8 kV contact discharge (IEC61000-4-2) – ±15 kV air-gap discharge (IEC61000-4-2) ESD protection for host side (A-side) – ±2 kV HBM (JEDEC 22-A114) – ±200 V MM (JEDEC 22-A115) ■ ■ ■ Flip Chip 25 ■ ■ ■ Operating temperature range –40 °C to +85 °C Space-saving Flip Chip 25 package (2 x 2 x 0.605 mm, 0.4 mm bump pitch) RoHS compliant, lead-free soldering capable ■ ■ ■ Applications ■ ■ ■ ■ ■ Mobile phones, smartphones PDAs Cameras S...