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TLP700F Dataheets PDF



Part Number TLP700F
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description Photocoupler
Datasheet TLP700F DatasheetTLP700F Datasheet (PDF)

TOSHIBA Photocoupler IRED + Photo IC TLP700F Industrial inverters Inverter for air conditioners IGBT/Power MOSFET gate drive The TLP700F consists of an infrared LED and an integrated photodetector. This unit is 6-lead SDIP package. The TLP700F is 50% smaller than the 8pin DIP and meets the reinforced insulation class requirements of international safety standards. Therefore the mounting area can be reduced in equipment requiring safety standard certification. The TLP700F is suitable for gate d.

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TOSHIBA Photocoupler IRED + Photo IC TLP700F Industrial inverters Inverter for air conditioners IGBT/Power MOSFET gate drive The TLP700F consists of an infrared LED and an integrated photodetector. This unit is 6-lead SDIP package. The TLP700F is 50% smaller than the 8pin DIP and meets the reinforced insulation class requirements of international safety standards. Therefore the mounting area can be reduced in equipment requiring safety standard certification. The TLP700F is suitable for gate driving circuits for IGBTs or power MOSFETs. In particular, the TLP700 is capable of “direct” gate driving of lowpower IGBTs. 4.58±0.25 654 123 +0.1 5 −0.2 5 6.8±0.25 TLP700F Unit: mm 7.62±0.25 +0.2 5 −0.1 5 3. 9 +0.1 0 −0.0 5 3.65 0.25± • Peak output current: ±2.0 A (max) • Guaranteed performance over temperature: -40 to 100°C • Supply current: 2.0 mA (max) • Power supply voltage: 15 to 30 V • Threshold input current: IFLH = 5 mA (max) • Switching time (tpLH / tpHL): 500 ns (max) • Common mode transient immunity: ±15 kV/μs (min) • Isolation voltage: 5000 Vrms (min) • UL-recognized: UL 1577, File No.E67349 • cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 • VDE-approved: EN 60747-5-5 , EN 62368-1 (Note 1) Note 1 : When a VDE approved type is needed, please designate the Option(D4). • Construction mechanical rating 10.16-mm pitch TLPXXXF type Creepage Distance Clearance Insulation Thickness 8.0 mm (min) 8.0 mm (min) 0.4 mm (min) Truth Table Input LED H ON L OFF M1 ON OFF M2 OFF ON Output H L 1.27±0.2 0.4±0.1 0.75±0.25 11.7±0.3 TOSHIBA 11-5J101S Weight: 0.26 g (t yp .) Pin Configuration (Top View) 1 2 3 SHIELD 6 1: ANODE 2: N.C 3: CATHODE 5 4: GND 5: VO ( OUTPUT ) 4 6: VCC Schematic IF 1+ VF 3- (M1) ICC VCC 6 (M2) IO VO 5 SHIELD GND 4 Note: A 0.1-μF bypass capacitor must be connected between pins 6 and 4. © 2019 1 Toshiba Electronic Devices & Storage Corporation Start of commercial production 2007-08 2019-09-25 Absolute Maximum Ratings (Ta = 25 °C) TLP700F Characteristics Symbol Rating Unit LE D Forward current Forward current derating (Ta ≥ 85°C) Peak transient forward current (Note 1) Reverse voltage Diode power dissipation Diode power dissipation derating (Ta ≥ 85 °C) IF ∆IF/∆Ta IFP VR PD ∆PD/∆Ta 20 -0.54 1 5 40 -1.0 mA mA/°C A V mW mW/°C Junction temperature “H” peak output current “L” peak output current Ta=-40 to 100 °C (Note 2) Tj IOPH IOPL 125 °C -2.0 A 2.0 A Detector Output voltage VO 35 V Supply voltage Power dissipation VCC PC 35 V 400 mW Junction temperature Tj 125 °C Operating frequency (Note 3) f 50 kHz Operating temperature range Topr -40 to 100 °C Storage temperature range Tstg -55 to 125 °C Lead soldering temperature (10 s) (Note 4) Tsol 260 °C Isolation voltage (AC, 60 s, R.H. ≤ 60 %) (Note 5) BVS 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temp.


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