DRAM-MODULE
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This version:
Feb. 23. 1999
Semiconductor MSC23137D-xxBS9/DS9
1,048,576-word x 36-bit DYNAMIC RAM...
Description
www.DataSheet.co.kr
This version:
Feb. 23. 1999
Semiconductor MSC23137D-xxBS9/DS9
1,048,576-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE
DESCRIPTION
The MSC23137D-xxBS9/DS9 is a fully decoded, 1,048,576-word x 36-bit CMOS dynamic random access memory module composed of nine 4Mb DRAMs in SOJ packages mounted with nine decoupling capacitors on a 72-pin glass epoxy single-inline package. This module supports any application where high density and large capacity of storage memory are required.
FEATURES
· 1,048,576-word x 36-bit organization · 72-pin socket insertable module MSC23137D-xxBS9 : Gold tab MSC23137D-xxDS9 : Solder tab · Single +5V supply ± 10% tolerance · Input : TTL compatible · Output : TTL compatible, 3-state · Refresh : 1024cycles/16ms · /CAS before /RAS refresh, hidden refresh, /RAS only refresh capability · Fast page mode capability · Multi-bit test mode capability
PRODUCT FAMILY
Access Time (Max.) Family tRAC MSC23137D-60BS9/DS9 MSC23137D-70BS9/DS9 60ns 70ns tAA 30ns 35ns tCAC 15ns 20ns tOEA 15ns 20ns
Cycle Time (Min.) Operating(Max.) Standby(Max.)
Power Dissipation
110ns 130ns
4455mW 49.5mW 3960mW
Datasheet pdf - http://www.DataSheet4U.net/
www.DataSheet.co.kr
Semiconductor
MSC23137D
MODULE OUTLINE
MSC23137D-xxBS9/DS9
107.95±0.2*1 101.19Typ. (Unit : mm) 5.28Max.
3.38Typ.
3.18
25.4±0.2 Typ. Typ. 10.16 6.35 2.03Typ. 6.35Typ. 3.7Min. +0.1 1.27 -0.08
1 1.27±0.1 R1.57 6.35 95.25 1.04Typ.
72
*1 The common size difference of the board wi...
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