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Rev.0.2, May. 2010 K9F4G08U0D K9K8G08U0D K9K8G08U1D K9WAG08U1D
Advance
4Gb D-die NAND Flash
Single-Level-Cell (1bit/cell)
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
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datasheet
History
Advance Rev. 0.2
FLASH MEMORY
Revision History
Revision No. 0.0 0.1 0.2 1. Initial issue 1. Corrected errata. 2. Chapter 1.2 Features revised. 1. DDP/QDP Part ID are added. Draft Date Jan. 12, 2010 May. 03, 2010 May. 26, 2010 Remark Advance Advance Advance Editor H.K.Kim H.K.Kim
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near your office.
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
datasheet
Advance Rev. 0.2
FLASH MEMORY
Table Of Contents
1.0 INTRODUCTION ........................................................................................................................................................ 4 1.1 General Description................................................................................................................................................. 4 1.2 Features .................................................................................................................................................................. 4 1.3 PRODUCT LIST ...................................................................................................................................................... 4 1.4 Pin Configuration (TSOP1) .......................................................................................................................