CPM-2F

rev. page date 1 of 2 07/2008 PART NUMBER: CPM-2F DESCRIPTION: peltier cooling unit CUI’s patented CPM-2 series cooling modules incorporate peltier technology in a convenient package that maximizes heat absorption and reduces overall assembly cost. The CPM-2 is assembled with our high performance peltier device between two precision-machined aluminum plates using thermally-conductive adhesive, leading to better heat transfer between the cooling and radiating surfaces. This module is perfect for applications such as refrigeration, lasers, dehumidifiers, NEMA enclosures, or any other electronic device that requires reliable, precision cooling. specifications max input voltage ¹ max current max temp drop (ΔTmax) max cooling power (Qmax) dielectric strength insulation resistance internal resistance ² cold plate temperature storage temperature operating temperature storage humidity operating humidity weight cooling medium heat radiation medium notes: 12 V dc 6A 73K (at Th=50° C) 46 W (at Th=Tc=50° C) 1200 V ac, 1 sec. 250 V dc, >10 M ohm 1.85 ~ 2.35 ohm -20°C ~ +60° C -20°C ~ +70° C 0°C ~ +35° C 10~90% 30~85% 200g aluminum plate aluminum plate 1. at inverse voltage “cold plate” becomes heat radiation plate 2. ambient temperature 25+/-1C, measured by 4 AC thermal method performance graphs www.DataSheet4U.com 20050 SW 112th Ave. Tualatin, Oregon 97062 phone 503.612.2300 fax 503.612.2383 REV. A DESCRIPTION NEW DRAWING DATE 6/6/2008 55.0 2.165 51.0 2.008 44.5 1.752 8.5 0....