MULTILAYER CHIP BEAD
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 1
MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G
A
ABC'S DWG NO....
Description
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 1
MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G
A
ABC'S DWG NO. ABC'S ITEM NO.
MB1608□□□□5□
¢¹¡O
www.DataSheet4U.com
D
D
C
B
I
G PCB Pattern
I Unit : m/m
Series MB1608
A 1.60±0.15
B 0.80±0.15
C 0.80±0.15
D 0.30±0.20
G 0.7
H 0.7
H I 0.7
¢º¡O
SCHEMATIC DIAGRAM ¡G
¢»¡O
MATERIALS ¡G
a¡ b¡ c¡ d¡ Body O Ferrite ¡ G G Internal conductor O Silver or Ag / Pd ¡ Remark O Lead¡ content G 1600ppm typ. include ferrite
a
b
c
Terminal electrode O Ag/Ni/Sn (Lead¡ contant 100ppm max.) G
¢¼¡O
GENERAL SPECIFICATION ¡G
a¡ b¡ c¡ Storage temp. O -40 ---- +105 ¡ ¡ F Type MB1608 d¡ Solderability O F ( kgf ) 0.5 time ( sec )
Temperature ( ¢J 250
50sec max.
G
¢ G Peak Temp¡
J J
Operating temp. O -25 ---- +85 ¡ Terminal Strength O
260 G ¢ max. ¢ J Max time above 230¢ J ¡ G 50sec max. Max G time above 200¢ J ¡ G 70sec max.
Temperature Rising Area +4.0¢J / sec max.
Preheat Area 150 ~ 200¢J / 60 ~ 120sec
Reflow Area +2.0 ~ 4.0¢J / sec max.
Forced Cooling Area -(1.0 ~ 5.0)¢J / sec max.
Peak Temperature: 260¢J 230¢J
30±5
200 150
70sec max.
¡ G Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5¢J Flux : Rosin Dip time : 4±1 seconds
)
100 50
0
50
100
150 Time ( seconds )
200
250
AE-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 2
MULTILAYER CHIP BEAD ELECTRICAL CHARACTERISTICS ¡G
DWG No. MB1608100Y5□ MB1608300Y5□ MB1608600Y5□ MB1608121Y5□ MB1608221Y5□ MB1608301Y5□ Impedance (Ω) 10.0...
Similar Datasheet