PROCESS
CPD66X
Low Leakage Diode
Low Leakage Diode Chip
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PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 17.5 x 17.5 MILS 5.9 MILS 7.9 MILS DIAMETER Al - 30,000Å Au-As - 13,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 54,848 PRINCIPAL DEVICE TYPES CMOD3003 CMLD3003DOG CMPD3003A CM...
