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CPD04

500mA Glass Passivated Rectifier

Description

PROCESS General Purpose Rectifier 500mA Glass Passivated Rectifier Chip CPD04 www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 26 x 26 MILS 8.5 MILS 14 x 14 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 18,00...

Central Semiconductor

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