PROCESS
Small Signal Transistors
PNP - Chopper Transistor Chip
CP734V
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PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES CMPT404A MPS404A EPITAXIAL PLANAR 31.5 x 31.5 MILS 7.0 MILS 4...
