PROCESS
Small Signal Transistors
CP716V
PNP - High Voltage Transistor Chip
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PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 29,659 PRINCIPAL DEVICE TYPES CMUT5401 CMPT5401 CXT5401 EPITAXIAL PLANAR 19.7 x 19.7 ...