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CP611

PNP Transistor

Description

PROCESS Power Transistor CP611 PNP - Amp/Switch Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 1,300 PRINCIPAL DEVICE TYPES CJD42C TIP42C EPITAXIAL PLANAR 80 x 99 MILS 12.5 ± 1 MILS 12 x 32 M...

Central Semiconductor

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