PROCESS
Small Signal TransistorPNP - Saturated Switch Transistor Chip
CP555
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PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 76,000 PRINCIPAL DEVICE TYPES CMPT3640 CMPT4209 2N4209 BACKSIDE COLLECTOR EPITAXIAL ...