2.45 GHz Balun / Filter Combination
High Frequency Ceramic Solutions
2.45 GHz, conjugate match for CSR Chipsets BC 03, 04
Detail Specification: 07/17/09 Gen...
Description
High Frequency Ceramic Solutions
2.45 GHz, conjugate match for CSR Chipsets BC 03, 04
Detail Specification: 07/17/09 General Specifications
Part Number Frequency (MHz) Unbalanced Impedence Differential Balanced Imp. Insertion Loss Return Loss Phase Difference Amplitude Difference 2450FB15K0002 2400~2500 50 Ω Conjucate match to CSR BC03, BC04 (16-j40) 3 dB max. 9.54 dB min. 180° ± 10 1.5 dB max. Operating Temperature Storage Temperature Power Capacity Reel Quantity Attenuation (dB) 48 min.@ 880~960MHz 30 min.@1710~1880 MHz 25 min.@1880~1990MHz 20 min.@4800~5000MHz 20 min.@7200~7500MHz -40 to +85°C
+5 to +35°C, Hum. 45 to 75%RH, 12 mos. Max
P/N 2450FB15K0002
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1 Watt max. 4000 Terminal Configuration
No.
Mechanical Dimensions
In L W T a b c g p 0.079 ± 0.008 0.049 ± 0.008 0.028 ± 0.004 0.012 ± 0.004 0.008 ± 0.004 0.012 +.004/-.008 0.014 ± 0.004 0.026 ± 0.002 mm 2.00 ± 0.20 1.25 ± 0.20 0.70 ± 0.10 0.30 ± 0.10 0.20 ± 0.10 0.30 +0.1/-0.2 0.35 ± 0.10 0.65 ± 0.05
Case size/type 43-3 g b L a c a p T W
Function Unbalanced Port NC or DC Feed NC GND Balanced Port GND Balanced Port GND 3 2 1 8 5 6 7
1 2 3 4 5 6 7 8
Mounting Considerations
* Line width should be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. ** By-pass capacitor should be connected when feeding DC power.
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4
1.0
0.35
*
Solder Resist 0.35 0.8 1.0 Land Through-hole ( φ0.3)
*
0.30
*
Units: mm
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