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K10P144M100SF2 Dataheets PDF



Part Number K10P144M100SF2
Manufacturers Freescale Semiconductor
Logo Freescale Semiconductor
Description K10 Sub-Family
Datasheet K10P144M100SF2 DatasheetK10P144M100SF2 Datasheet (PDF)

Freescale Semiconductor Data Sheet: Product Preview Document Number: K10P144M100SF2 Rev. 4, 3/2011 Supports the following: MK10X128VLQ100, MK10X128VMD100, MK10X256VLQ100, MK10X256VMD100, MK10N512VLQ100, MK10N512VMD100 K10 Sub-Family Data Sheet K10P144M100SF2 Features • Operating Characteristics – Voltage range: 1.71 to 3.6 V – Flash write voltage range: 1.71 to 3.6 V – Temperature range (ambient): -40 to 105°C • Performance – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering.

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Freescale Semiconductor Data Sheet: Product Preview Document Number: K10P144M100SF2 Rev. 4, 3/2011 Supports the following: MK10X128VLQ100, MK10X128VMD100, MK10X256VLQ100, MK10X256VMD100, MK10N512VLQ100, MK10N512VMD100 K10 Sub-Family Data Sheet K10P144M100SF2 Features • Operating Characteristics – Voltage range: 1.71 to 3.6 V – Flash write voltage range: 1.71 to 3.6 V – Temperature range (ambient): -40 to 105°C • Performance – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz • Memories and memory interfaces – Up to 512 KB program flash memory on nonFlexMemory devices – Up to 256 KB program flash memory on FlexMemory devices – Up to 256 KB FlexNVM on FlexMemory devices – 4 KB FlexRAM on FlexMemory devices – Up to 128 KB RAM – Serial programming interface (EzPort) – FlexBus external bus interface • Clocks – 3 to 32 MHz crystal oscillator – 32 kHz crystal oscillator – Multi-purpose clock generator • System peripherals – 10 low-power modes to provide power optimization based on application requirements – Memory protection unit with multi-master protection www.DataSheet4U.com – 16-channel DMA controller, supporting up to 64 request sources – External watchdog monitor – Software watchdog – Low-leakage wakeup unit • Security and integrity modules – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip • Human-machine interface – Low-power hardware touch sensor interface (TSI) – General-purpose input/output • Analog modules – Two 16-bit SAR ADCs – Programmable gain amplifier (up to x64) integrated into each ADC – Two 12-bit DACs – Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference • Timers – Programmable delay block – Eight-channel motor control/general purpose/PWM timer – Two 2-channel quadrature decoder/general purpose timers – Periodic interrupt timers – 16-bit low-power timer – Carrier modulator transmitter – Real-time clock • Communication interfaces – Two Controller Area Network (CAN) modules – Three SPI modules – Two I2C modules – Six UART modules – Secure Digital host controller (SDHC) – I2S module This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. © 2010–2011 Freescale Semiconductor, Inc. Preliminary www.DataSheet4U.com K10 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011. 2 Preliminary Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts...........................................................................4 1.1 Determining valid orderable parts......................................4 2 Part identification......................................................................4 2.1 Description.........................................................................4 2.2 Format...............................................................................4 2.3 Fields.................................................................................4 2.4 Example............................................................................5 3 Terminology and guidelines......................................................5 3.1 Definition: Operating requirement......................................5 3.2 Definition: Operating behavior...........................................6 3.3 Definition: Attribute............................................................6 3.4 Definition: Rating...............................................................7 3.5 Result of exceeding a rating..............................................7 3.6 Relationship between ratings and operating requirements......................................................................7 3.7 Guidelines for ratings and operating requirements............8 3.8 Definition: Typical value.....................................................8 3.9 Typical value conditions....................................................9 4 Ratings......................................................................................9 4.1 Thermal handling ratings...................................................10 4.2 Moisture handling ratings..................................................10 4.3 ESD handling ratings.........................................................10 4.4 Voltage and current operating ratings...............................10 5 General.....................................................................................11 5.1 Nonswitching electrical specifications...............................11 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 5.1.7 5.1.8 Voltage and current operating requirements.........11 LVD and POR operating requirements.................12 Voltage and current operating behaviors..............12 Power mode transition operating behaviors..........13 Power consumption operating behaviors..............14 EMC radiated emissions operating behaviors.......17 Desig.


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