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K4S560432J Dataheets PDF



Part Number K4S560432J
Manufacturers Samsung semiconductor
Logo Samsung semiconductor
Description 256Mb J-die SDRAM Specification
Datasheet K4S560432J DatasheetK4S560432J Datasheet (PDF)

K4S560432J K4S560832J K4S561632J Synchronous DRAM 256Mb J-die SDRAM Specification 54 TSOP-II with Lead-Free & Halogen-Free (RoHS compliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS I.

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K4S560432J K4S560832J K4S561632J Synchronous DRAM 256Mb J-die SDRAM Specification 54 TSOP-II with Lead-Free & Halogen-Free (RoHS compliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. www.DataSheet4U.com 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. 1 of 15 Rev. 1.22 August 2008 K4S560432J K4S560832J K4S561632J Synchronous DRAM Table of Contents 1.0 Features ....................................................................................................................................... 4 2.0 General Description ................................................................................................................... 4 3.0 Ordering Information .................................................................................................................. 4 4.0 Package Physical Dimension ................................................................................................... 5 5.0 Functional Block Diagram......................................................................................................... 6 6.0 Pin Configuration (Top view) ..................................................................................................... 7 7.0 Pin Function Description ........................................................................................................... 7 8.0 Absolute Maximum Ratings........................................................................................................8 9.0 DC Operating Conditions ........................................................................................................... 8 10.0 Capacitance............................................................................................................................... 8 11.0 DC Characteristics (x4, x8) ......................................................................................................9 12.0 DC Characteristics (x16) ........................................................................................................10 13.0 AC Operating Test Conditions ...............................................................................................11 14.0 Operating AC Parameter ........................................................................................................11 15.0 AC Characteristics ..................................................................................................................12 16.0 DQ Buffer Output Drive Characteristics ...............................................................................12 17.0 IBIS Specification .....................................................................................................................13 18.0 Simplified Truth Table ............................................................................................................15 www.DataSheet4U.com 2 of 15 Rev. 1.22 August 2008 K4S560432J K4S560832J K4S561632J Synchronous DRAM Month June October January March August Year 2007 2007 2008 2008 2008 - Release 1.0 version SPEC - Changed IDD current SPEC - Revised typo of package dimension - Added the comment of Halogen-free supporting - Added 200Mhz speed - Added Package pin out lead width - Added 200MHz current SPEC - Corrected font format History Revision History Revision 1.0 1.1 1.2 1.21 1.22 www.DataSheet4U.com 3 of 15 Rev. 1.22 August 2008 K4S560432J K4S560832J K4S561632J Synchronous DRAM 16M x 4Bit x 4 Banks / 8M x 8Bit x 4 Banks / 4M x 16Bit x 4 Banks SDRAM 1.0 Features • • • • JEDEC standard 3.3V power supply LVTTL compatible with multiplexed address Four banks operation MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) All inputs are sampled at the positive going edge of the system clock. Burst read single-bit write operation DQM (x4,x8) & L(U)DQM (x16) for masking Auto & self refresh 64ms refresh period (8K Cycle) Lead-Free & Halogen-Free Package RoHS compliant • • • • • • • 2.0 General Description The K4S560432J / K4S560832J / K4S561632J is 268,435,456 bits synchronous high data rate Dynamic RAM organized as.


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