DatasheetsPDF.com

CP382X

Central Semiconductor
Part Number CP382X
Manufacturer Central Semiconductor
Description Small Signal Transistor NPN - Low VCE(SAT) Transistor Chip
Published Apr 1, 2011
Detailed Description PROCESS Small Signal Transistor CP382X NPN - Low VCE(SAT) Transistor Chip PROCESS DETAILS Die Size Die Thickness Bas...
Datasheet PDF File CP382X PDF File

CP382X
CP382X

Overview
PROCESS Small Signal Transistor CP382X NPN - Low VCE(SAT) Transistor Chip PROCESS DETAILS Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization 26 x 26 MILS 5.
9 MILS 5.
5 x 5.
5 MILS 5.
5 x 5.
5 MILS Al - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 25,536 PRINCIPAL DEVICE TYPES CMLT3820G CMPT3820 CXT3820 R0 (9-September 2010) w w w.
c e n t r a l s e m i .
c o m com PROCESS CP382X Typical Electrical Characteristics R0 (9-September 2010) w w w.
c e n t r a l s e m i .
c o m com ...


Similar Datasheet


Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)