Power Transistors NPN - High Current Transistor Chip
Description
PROCESS
Power Transistors
CP315V
NPN - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER EPITAXIAL PLANAR 40 x 40 MILS 7.1 MILS 7.9 x 8.7 MILS 9.0 x 14 MILS Al - 30,000Å Au - 12,000Å
6,936
PRINCIPAL DE...