Small Signal Transistor NPN - High Current Transistor Chip
Description
Central
TM
PROCESS
CP314
Semiconductor Corp.
Small Signal TransistorNPN - High Current Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 6,936 PRINCIPAL DEVICE TYPES CBCP68 CBCX68 CZT651 MPS650 MPS651 EPITAXIAL P...