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Part Number 85500
Manufacturers Molex Electronics
Logo Molex Electronics
Description Super-Flat RJ45 Compression Jack
Datasheet 85500 Datasheet85500 Datasheet (PDF)

Super-Flat RJ45 Compression Jack Super-Flat RJ45 Compression Jack The Super-Flat RJ45 Compression Jack provides a very low profile RJ 45 solution with 7,6 mm mounting height above PCB. The solderless, straddle mount jack can be front mounted and ganged in 4-port modules to fit Advanced Mezzanine Card requirements. The solderless straddle mounting does not require any specific solder process or separate press-fit operation and it simplifies the recycling process Series 85500 Super-Flat, Solderle.

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Super-Flat RJ45 Compression Jack Super-Flat RJ45 Compression Jack The Super-Flat RJ45 Compression Jack provides a very low profile RJ 45 solution with 7,6 mm mounting height above PCB. The solderless, straddle mount jack can be front mounted and ganged in 4-port modules to fit Advanced Mezzanine Card requirements. The solderless straddle mounting does not require any specific solder process or separate press-fit operation and it simplifies the recycling process Series 85500 Super-Flat, Solderless Features •Very low profile (7,6 mm above PCB) •Straddle mount •Solderless Benefits •Suitable for flat applications •No pin holes neccessary •To be mounted after soldering •Eases recycling •To be mounted as last component •EMI/RFI protection •Multiple ports •Signal detection •Front mountable •Shielded •Stackable in 4 port metal frame •Light pipes optional Markets and Applications „ Advanced Mezzanine Cards (AMC) for Advanced Telecommunications www.DataSheet4U.com Computing Architecture (ATCA) and µTCA „ Telecommunication, Computing Specifications Reference Information Packaging: Tray Mates With: IEC-60603-7 plugs Designed In: Millimeters Electrical Voltage: 56.5V DC Current: 1.5A Contact Resistance: 25 milliohms Dielectric Withstanding Voltage:1000V AC Insulation Resistance: 500 Megohms Super-Flat RJ45 Compression Jack Mechanical Contact Insertion Force: 22N Contact Withdrawal Force: 22N Durability: 750 cycles Physical Housing: Polyamide GF UL94 V-0 Contact Area: 50 microinches Gold Solder Tail Area: Pure Tin Underplating: Nickle PCB Thickness: 1.6mm Operating Temperature: -55°C to +105°C Series 85500 Super-Flat, Solderless Order No. 85500-0005 85500-0006 Description Single Jack Jack Assembly Kit with Metal Frame www.DataSheet4U.com Bringing People & Technology Together, WorldwideSM Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX [email protected] Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Visit our Web site at http://www.molex.com .


80-GC6NLT1 85500 900-XC6DT2


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