ATS-50190P-C2-R0

Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-50190P-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard height components from 3 to 4.5mm C D » » B A » » Thermal Performance Air Velocity *Image above is for illustration purposes only. Thermal Resistance FT/MIN 200 300 400 500 600 700 800 M/S 1.0 1.5 2.0 2.5 3.0 3.5 4.0 °C/W (UNDUCTED FLOW) 7.7 6.3 5.6 5 4.6 4.3 4 °C/W (DUCTED FLOW) 6.4 Product Details DIMENSION A 19 mm Notes: 2) 3) 4) 5) 6) DIMENSION B 19 mm DIMENSION C 17.5 mm DIMENSION D 34.7 mm INTERFACE MATERIAL Saint-gobain C1100F FINISH BLUE-ANODIZED 1) Dimension C = heat sink height from bottom of the base to the top of the fin field. www.DataSheet4U.com ATS-50190P-C1-R0 is a subsitute item available utilizing an equivalent phase change material (Chomerics T766). Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or...