LX3045

INTEGRATED PRODUCTS Obsolete Product – Not Recommended For New Design LX3044 / 45 / 46 10.3 Gbps Coplanar GaAs PIN Photo Diode PRODUCTION DATA SHEET WWW.Microsemi .COM DESCRIPTION KEY FEATURES Microsemi’s GaAs Coplanar PIN The LX304X family of photo diodes ƒ LX3044 Single Die Photo Diode chips are ideal for high are currently offered in die form ƒ LX3045, 1x4 Array Die bandwidth 850nm optical networking allowing manufacturers the versatility applications. of custom assembly using either bond The device family offers superior wire or flip chip configurations. ƒ LX3046, 1x12 Array Die ƒ Coplanar Waveguide , 50ohm ƒ High Responsivity ƒ Low Dark Current noise performance and sensitivity in This device is ideal for single die, 1x4 array die or 1x12 array manufacturers of optical receivers, die. transponders, optical transmission modules and combination PIN photo diode – transimpedance amplifier. te IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com le PRODUCT HIGHLIGHT o ƒ Coplanar Design (gnd-signal-gnd) 50 ohm characteristic impedance ƒ 125µm standard pad pitch for ease of test ƒ Large 75µm x 75µm pad size for ease of packaging s ƒ Wire bond or Flip Chip capability Single Die ƒ High Bandwidth ƒ Anode/Cathode on Illuminated Side ƒ 125mm Pad pitch ƒ Die Good for Bond Wire or Flip Chip Applications APPLICATIONS ƒ Short Reach Optical Networks ƒ 10Gigabit Ethernet, Fibre Channel ƒ VCSEL Array Receiver BENEFITS ƒ Large W...