CNH20R475M-xM

www.DataSheet4U.com PERFORMANCE AND TEST METHOD Item Performance CG, UJ R F Testing method and conditions (In accordance with JIS C5101-1) CG : 1MHz UJ, R, F : 1kHz Measurement voltage : 0.5~2Vrms Application time is 1~5seconds. CG, UJ : 300% of rated voltage R, F : 250% of rated voltage Rated voltage is applied for 1 minute. MARUWA GENERAL CATALOG Dissipation Factor 2.5% or less ‫ء‬1) 5% or less ‫ء‬1) Withstanding voltage No insulation breakdown and no failure. No less than 10,000M⍀ or 500M⍀ ␮F, whichever is smaller. Chip Insulation resistance Adhesion strength of termination 5N No peeling-off or exfoliation shall be manifest or recognizable in its incipient stages. No remarkable damage Within specified tolerance Initial standard values must be satisfied. No remarkable damage No more than ȗ2.5% or ȗ0.25pF, whichever is larger. Within ȗ7.5% Within ȗ20% Solder a specimen on the testing jig shown on the left and apply a force of 5N (0.51kgf) in the direction indicated by arrow. Substrate Visual Vibration resistance Capacitance Dissipation factor Visual Resistance to soldering heat Capacitance Dissipation factor Insulation resistance Withstanding voltage Vibration frequency : 10~55Hz Full amplitude : 1.5mm, 10~55~10Hz 1min. XYZ direction 2hrs for each total 6hrs. Solder Soldering temperature Immersion time Preheat : H60A or H63A (JIS Z 3282) : 270ȗ5°C : 10ȗ1sec. : 80~100°C (1~2min.) and 170~200°C (1~min.) Immersion into solder should be carried out continuously af...