Document
NCP571, NCV571
Voltage Regulator - CMOS,
Low Iq, Low Output
150 mA
The NCP571 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The NCP571 series features an ultra−low quiescent current of 4.0 mA. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits.
The NCP571 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 mF. The device is housed in the TSOP−5 or DFN6 surface mount package. Standard voltage versions are 0.8 V, 0.9 V, 1.0 V and 1.2 V.
Features
• Low Quiescent Current of 4.0 mA Typical • Maximum Operating Voltage of 12 V • Low Output Voltage Option down to 0.8 V • High Accuracy Output Voltage of 3.0% • Industrial Temperature Range of −40°C to +85°C
(NCV571, TA = −40°C to +125°C)
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
• These are Pb−Free Devices
Typical Applications
• Battery Powered Instruments • Hand−Held Instruments • Camcorders and Cameras
Vin 1 Thermal Shutdown
Enable ON 3
Driver w/ Current
Limit
Vout 5 +
OFF
GND 2
Figure 1. Representative Block Diagram
http://onsemi.com
5 1
TSOP−5 SN SUFFIX CASE 483
6
1 DFN6 MN SUFFIX CASE 506BA
MARKING DIAGRAMS
XXXAYWG G
1 XX MG G
XXX A Y W M
G
= Specific Device Code = Assembly Location = Year = Work Week = Date Code = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
October, 2019 − Rev. 5
1
Publication Order Number: NCP571/D
NCP571, NCV571
PIN CONNECTIONS
TSOP−5 package
DFN6 package
Vin 1 GND 2
5 Vout
Vout 1
6 Vin
NC 2 EP 5 NC
Enable 3
4 NC
(Top View)
GND 3
4 Enable
(Top View)
PIN FUNCTION DESCRIPTION
DFN6
TSOP−5
Pin Name
1 5 Vout
24
NC
3 2 GND
4 3 Enable
5− 61 EP −
NC Vin EP
Description Regulated output voltage. No Internal Connection. It is recommended to connect this pin to GND potential. Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable pin should be connected to Vin. No Internal Connection. It is recommended to connect this pin to GND potential. Positive power supply input voltage. No Internal Connection. It is recommended to connect this pin to GND potential.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage Enable Voltage Output Voltage Power Dissipation Operating Junction Temperature Operating Ambient Temperature
NCP571 NCV571
Vin
0 to 12
V
VEN −0.3 to Vin + 0.3 V
Vout −0.3 to Vin + 0.3 V
PD
Internally Limited
W
TJ
+150
°C
TA
−40 to +85
°C
−40 to +125
Storage Temperature
Tstg
−55 to +150
°C
ESD Capability, Human Body Model (Note 1)
ESDHBM
2000
V
ESD Capability, Machine Mode (Note 1)
ESDMM
200
V
ESD Capability, Charged Device Model (Note 1)
ESDCDM
1000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard) 2. Latchup capability (85°C) $100 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating
Symbol
Test Conditions
Typical Value
Unit
Junction−to−Ambient
TSOP−5
RqJA
1 oz Copper Thickness, 100 mm2
250
°C/W
PSIJ−Lead 2
TSOP−5
YJ−L2
1 oz Copper Thickness, 100 mm2
68
°C/W
Junction−to−Ambient
DFN6
RqJA
1 oz Copper Thickness, 100 mm2
190
°C/W
PSIJ−Lead 2
DFN6
YJ−L2
1 oz Copper Thickness, 100 mm2
84
°C/W
NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.
http://onsemi.com 2
Vin
GND Enable
C1 0.1 mF
NCP571, NCV571
1 Vin
2 GND
Vout 5 NC 4 EN 3
Vout
C2 0.1 mF
GND
Figure 2. Typical Application Schematic for TSOP−5 Package
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom) + 1.0 V, VEN = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C, unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max Unit
Output Voltage (TA = 25°C, Iout = 10 mA) 0.8 V 0.9 V 1.