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NCP571 Dataheets PDF



Part Number NCP571
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description 150mA CMOS Low Iq Low Output Voltage Regulator
Datasheet NCP571 DatasheetNCP571 Datasheet (PDF)

NCP571, NCV571 Voltage Regulator - CMOS, Low Iq, Low Output 150 mA The NCP571 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The NCP571 series features an ultra−low quiescent current of 4.0 mA. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit pro.

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NCP571, NCV571 Voltage Regulator - CMOS, Low Iq, Low Output 150 mA The NCP571 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The NCP571 series features an ultra−low quiescent current of 4.0 mA. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP571 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 mF. The device is housed in the TSOP−5 or DFN6 surface mount package. Standard voltage versions are 0.8 V, 0.9 V, 1.0 V and 1.2 V. Features • Low Quiescent Current of 4.0 mA Typical • Maximum Operating Voltage of 12 V • Low Output Voltage Option down to 0.8 V • High Accuracy Output Voltage of 3.0% • Industrial Temperature Range of −40°C to +85°C (NCV571, TA = −40°C to +125°C) • NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable • These are Pb−Free Devices Typical Applications • Battery Powered Instruments • Hand−Held Instruments • Camcorders and Cameras Vin 1 Thermal Shutdown Enable ON 3 Driver w/ Current Limit Vout 5 + OFF GND 2 Figure 1. Representative Block Diagram http://onsemi.com 5 1 TSOP−5 SN SUFFIX CASE 483 6 1 DFN6 MN SUFFIX CASE 506BA MARKING DIAGRAMS XXXAYWG G 1 XX MG G XXX A Y W M G = Specific Device Code = Assembly Location = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. © Semiconductor Components Industries, LLC, 2014 October, 2019 − Rev. 5 1 Publication Order Number: NCP571/D NCP571, NCV571 PIN CONNECTIONS TSOP−5 package DFN6 package Vin 1 GND 2 5 Vout Vout 1 6 Vin NC 2 EP 5 NC Enable 3 4 NC (Top View) GND 3 4 Enable (Top View) PIN FUNCTION DESCRIPTION DFN6 TSOP−5 Pin Name 1 5 Vout 24 NC 3 2 GND 4 3 Enable 5− 61 EP − NC Vin EP Description Regulated output voltage. No Internal Connection. It is recommended to connect this pin to GND potential. Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable pin should be connected to Vin. No Internal Connection. It is recommended to connect this pin to GND potential. Positive power supply input voltage. No Internal Connection. It is recommended to connect this pin to GND potential. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Enable Voltage Output Voltage Power Dissipation Operating Junction Temperature Operating Ambient Temperature NCP571 NCV571 Vin 0 to 12 V VEN −0.3 to Vin + 0.3 V Vout −0.3 to Vin + 0.3 V PD Internally Limited W TJ +150 °C TA −40 to +85 °C −40 to +125 Storage Temperature Tstg −55 to +150 °C ESD Capability, Human Body Model (Note 1) ESDHBM 2000 V ESD Capability, Machine Mode (Note 1) ESDMM 200 V ESD Capability, Charged Device Model (Note 1) ESDCDM 1000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard) 2. Latchup capability (85°C) $100 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Symbol Test Conditions Typical Value Unit Junction−to−Ambient TSOP−5 RqJA 1 oz Copper Thickness, 100 mm2 250 °C/W PSIJ−Lead 2 TSOP−5 YJ−L2 1 oz Copper Thickness, 100 mm2 68 °C/W Junction−to−Ambient DFN6 RqJA 1 oz Copper Thickness, 100 mm2 190 °C/W PSIJ−Lead 2 DFN6 YJ−L2 1 oz Copper Thickness, 100 mm2 84 °C/W NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. http://onsemi.com 2 Vin GND Enable C1 0.1 mF NCP571, NCV571 1 Vin 2 GND Vout 5 NC 4 EN 3 Vout C2 0.1 mF GND Figure 2. Typical Application Schematic for TSOP−5 Package ELECTRICAL CHARACTERISTICS (Vin = Vout(nom) + 1.0 V, VEN = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C, unless otherwise noted) Characteristic Symbol Min Typ Max Unit Output Voltage (TA = 25°C, Iout = 10 mA) 0.8 V 0.9 V 1.


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