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MAX8836Z Dataheets PDF



Part Number MAX8836Z
Manufacturers Maxim Integrated Products
Logo Maxim Integrated Products
Description 1.2A PWM Step-Down Converter In 2mm X 2mm WLP/UCSP
Datasheet MAX8836Z DatasheetMAX8836Z Datasheet (PDF)

19-4059; Rev 1; 9/08 www.DataSheet4U.com 1.2A PWM Step-Down Converter in 2mm x 2mm WLP/UCSP for PA Power General Description The MAX8836Z high-frequency step-down converter is optimized to provide a fixed output voltage with ultralow dropout. The device integrates a high-efficiency PWM step-down converter for medium- and low-power transmission, and a 60mΩ typical bypass FET for ultra low-dropout operation. A 200mA low-noise, high-PSRR low-dropout regulator (LDO) is also integrated. Fast-switch.

  MAX8836Z   MAX8836Z


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19-4059; Rev 1; 9/08 www.DataSheet4U.com 1.2A PWM Step-Down Converter in 2mm x 2mm WLP/UCSP for PA Power General Description The MAX8836Z high-frequency step-down converter is optimized to provide a fixed output voltage with ultralow dropout. The device integrates a high-efficiency PWM step-down converter for medium- and low-power transmission, and a 60mΩ typical bypass FET for ultra low-dropout operation. A 200mA low-noise, high-PSRR low-dropout regulator (LDO) is also integrated. Fast-switching allows the use of small ceramic input and output capacitors while maintaining low ripple voltage. The feedback network is integrated, further reducing external component count and total solution size. At high duty cycle, the MAX8836Z automatically switches to the bypass mode, connecting the input to the output through a low-impedance (60mΩ typ) MOSFET. The LDO in the MAX8836Z is designed for low-noise operation (35µVRMS typ). Both the PWM step-down and LDO are individually enabled through separate logic-control interfaces. The MAX8836Z is available in 16-bump, 2mm x 2mm WLP and UCSP™ packages (0.7mm max height). Features o PA Step-Down Converter Selectable Output Voltage (3.1V or 3.4V) 25µs Settling Time for 3.1V to 3.4 VOUT Change 60mΩ PFET at 100% Duty-Cycle for Low Dropout Low Output Voltage Ripple 1.2A Output Drive Capability ±2% Output Voltage Accuracy Tiny External Components o Low-Noise LDO Low 35µVRMS (typ) Output Noise High 65dB (typ) PSRR Guaranteed 200mA Output Current Drive Capability ON/OFF Control o Low 0.1µA Shutdown Current o 2.7V to 5.5V Supply Voltage Range o Thermal Shutdown o Tiny 2mm x 2mm x 0.7mm WLP and UCSP Packages (4 x 4 Grid) MAX8836Z Applications WCDMA/NCDMA Cellular Handsets Wireless PDAs Smartphones INPUT Li+ BATTERY OUTPUT 3.1V OR 3.4V IN 4.7µF GND LX 4.7µF PA 2.2µH Typical Operating Circuit Ordering Information PART MAX8836ZEWEEE+T MAX8836ZEREEE+T PIN-PACKAGE 16 WLP (W162B2+1) 16 UCSP (R162A2+1) TEMP RANGE -40°C to +85°C MAX8836Z SET OUTPUT HP PA_EN EN2 REFBP 0.22µF LDO2 1µ F 200mA -40°C to +85°C ENABLE BUCK ENABLE LDO +Denotes a lead-free/RoHS-compliant package. T = Tape and reel. Pin Configuration appears at end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. www.DataSheet4U.com 1.2A PWM Step-Down Converter in 2mm x 2mm WLP/UCSP for PA Power MAX8836Z ABSOLUTE MAXIMUM RATINGS IN1A, IN1B, IN2, EN2, REFBP to AGND................-0.3V to +6.0V PAA, PAB, PA_EN, HP to AGND....-0.3V to (VIN1A/VIN1B + 0.3V) LDO2 to AGND ..........................................-0.3V to (VIN2 + 0.3V) IN2 to IN1B/IN1A ...................................................-0.3V to +0.3V PGND to AGND .....................................................-0.3V to +0.3V LX Current ......................................................................0.7ARMS IN1A/IN1B and PAA/PAB Current .....................................2ARMS PAA and PAB Short Circuit to GND or IN...................Continuous Continuous Power Dissipation (TA = +70°C) 16-Bump WLP (derate 12.5mW/°C above +70°C).............1W 16-Bump UCSP (derate 12.5mW/°C above +70°C) ..........1W Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Bump Temperature (soldering, reflow) ............................+260°C Note: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VIN1A = VIN1B = VIN2 = VPA_EN = VEN2 = 3.6V, VHP = 0V, TA = -40°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER INPUT SUPPLY Input Voltage Input Undervoltage Threshold HP, PA_EN, EN2 Pulldown Resistor Shutdown Supply Current VPA_EN = VEN2 = 0V VPA_EN = 0V, ILDO2 = 0A No-Load Supply Current THERMAL PROTECTION Thermal Shutdown LOGIC CONTROL PA_EN, EN2, HP Logic-Input High Voltage PA_EN, EN2, HP Logic-Input Low Voltage Logic-Input Current (PA_EN, EN2, HP) PA OUTPUT VOLTAGE Output Voltage Output Voltage.


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