Document
ESD7M5.0DT5G
ESD Protection Diode
Ultra−Low Capacitance
The ESD7M5.0DT5G is designed to protect voltage sensitive
components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping
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capability, low leakage and fast response time are combined with an
ultra low diode capacitance of 2.5 pF to provide best in class
protection from IC damage due to ESD. The ultra small SOT−723 package is ideal for designs where board space is at a premium. The
PIN 1. CATHODE 1
2. CATHODE
3. ANODE
2
3
ESD7M5.0DT5G can be used to protect two uni−directional lines or
one bi−directional line. When used to protect one bi−directional line,
the effective capacitance is 1.25 pF. Because of its low capacitance, it
is well suited for protecting high frequency signal lines such as
USB2.0 high speed and antenna line applications.
Specification Features:
• Low Capacitance 2.5 pF Max • Low Clamping Voltage • Small Body Outline Dimensions:
0.047” x 0.047” (1.20 mm x 1.20 mm)
• Low Body Height: 0.020″ (0.5 mm) • Stand−off Voltage: 5 V • Low Leakage • Response Time is Typically < 1.0 ns • IEC61000−4−2 Level 4 ESD Protection • This is a Pb−Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements
SOT−723 CASE 631AA
MARKING DIAGRAM
L7 M 1 L7 = Specific Device Code M = Date Code
ORDERING INFORMATION
Device
Package
Shipping†
ESD7M5.0DT5G SOT−723 8000/Tape & Reel (Pb−Free)
MAXIMUM RATINGS
Rating
Symbol
IEC 61000−4−2 (ESD)
Contact
Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum (10 Second Duration)
°PD°
Tstg TJ TL
Value
Unit
±10
kV
150
mW
−55 to +150 °C
−55 to +125 °C
260
°C
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2013
1
May, 2018 − Rev. 6
Publication Order Number: ESD7M5.0D/D
ESD7M5.0DT5G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Parameter
IPP VC VRWM IR VBR IT IF VF Ppk C
Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Curr.