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ESD7M5.0DT5G Dataheets PDF



Part Number ESD7M5.0DT5G
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description ESD Protection Diode
Datasheet ESD7M5.0DT5G DatasheetESD7M5.0DT5G Datasheet (PDF)

ESD7M5.0DT5G ESD Protection Diode Ultra−Low Capacitance The ESD7M5.0DT5G is designed to protect voltage sensitive components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping www.onsemi.com capability, low leakage and fast response time are combined with an ultra low diode capacitance of 2.5 pF to provide best in class protection from IC damage due to ESD. The ultra small SOT−723 package is ideal for designs where b.

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ESD7M5.0DT5G ESD Protection Diode Ultra−Low Capacitance The ESD7M5.0DT5G is designed to protect voltage sensitive components from damage due to ESD in applications that require ultra low capacitance to preserve signal integrity. Excellent clamping www.onsemi.com capability, low leakage and fast response time are combined with an ultra low diode capacitance of 2.5 pF to provide best in class protection from IC damage due to ESD. The ultra small SOT−723 package is ideal for designs where board space is at a premium. The PIN 1. CATHODE 1 2. CATHODE 3. ANODE 2 3 ESD7M5.0DT5G can be used to protect two uni−directional lines or one bi−directional line. When used to protect one bi−directional line, the effective capacitance is 1.25 pF. Because of its low capacitance, it is well suited for protecting high frequency signal lines such as USB2.0 high speed and antenna line applications. Specification Features: • Low Capacitance 2.5 pF Max • Low Clamping Voltage • Small Body Outline Dimensions: 0.047” x 0.047” (1.20 mm x 1.20 mm) • Low Body Height: 0.020″ (0.5 mm) • Stand−off Voltage: 5 V • Low Leakage • Response Time is Typically < 1.0 ns • IEC61000−4−2 Level 4 ESD Protection • This is a Pb−Free Device Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements SOT−723 CASE 631AA MARKING DIAGRAM L7 M 1 L7 = Specific Device Code M = Date Code ORDERING INFORMATION Device Package Shipping† ESD7M5.0DT5G SOT−723 8000/Tape & Reel (Pb−Free) MAXIMUM RATINGS Rating Symbol IEC 61000−4−2 (ESD) Contact Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Storage Temperature Range Junction Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) °PD° Tstg TJ TL Value Unit ±10 kV 150 mW −55 to +150 °C −55 to +125 °C 260 °C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2013 1 May, 2018 − Rev. 6 Publication Order Number: ESD7M5.0D/D ESD7M5.0DT5G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP VC VRWM IR VBR IT IF VF Ppk C Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Curr.


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