AWC6323

HELP3ETM Dual-band Cellular & PCS CDMA 3.4 V Linear Power Amplifier Module FEATURES Data Sheet - Rev 2.0 InGaP HBT Technology High Efficiency: 37 % @ +27.6 dBm 22 % @ +16 dBm 11 % @ +10 dBm www.DataSheet4U.com AWC6323 Low Quiescent Current: <4 mA Internal Voltage Regulation Built-in Directional Coupler Common VMODE Control Line Simplified VCC Bus PCB routing Reduced External Component Count Low Profile Surface Mount Package: 1 mm RoHS Compliant Package, 260 oC MSL-3 AW C 632 3 APPLICATIONS Cell & PCS Dual-band Wireless Handsets and Data Devices for CDMA/EVDO networks. M47 Package 14 Pin 3 mm x 5 mm x 1 mm Surface Mount Module CPL_OUT. The 3 mm x 5 mm x 1 mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 Ω system. PRODUCT DESCRIPTION AWC6323 addresses the demand for increased integration in dual-band handsets for CDMA networks. The small footprint 3 mm x 5 mm x 1 mm surfacemount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs. The package pinout was chosen to enable handset manufacturers to easily route bias to both power amplifiers and simplify control with common mode pins. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, an...