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L-HSM002-HTS Dataheets PDF



Part Number L-HSM002-HTS
Manufacturers Para Light
Logo Para Light
Description 3.0mm LED LAMP
Datasheet L-HSM002-HTS DatasheetL-HSM002-HTS Datasheet (PDF)

PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan,. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: [email protected] DATA SHEET PART NO. : L-HSM002-HTS REV : A/0 CUSTOMER’S APPROVAL : _______________ DRAWING NO. : DS-60-07-0174 DATE : 2007-7-2 DCC : ____________ Page : 1 3.0 mm LED LAMP WITH SMH-01-LG HOLDER REV:A / 0 L-HSM002-HTS PACKAGE DIMENSIONS PARA PARA Note: 1.All Dimensions are in millimeters. 2.Toleran.

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PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan,. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: [email protected] DATA SHEET PART NO. : L-HSM002-HTS REV : A/0 CUSTOMER’S APPROVAL : _______________ DRAWING NO. : DS-60-07-0174 DATE : 2007-7-2 DCC : ____________ Page : 1 3.0 mm LED LAMP WITH SMH-01-LG HOLDER REV:A / 0 L-HSM002-HTS PACKAGE DIMENSIONS PARA PARA Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6.The lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling. 7.A =L-3541GD-D1-G07-AH-HTS-9.4 8..Housing material: NYLON66 UL94-V0-LG DRAWING NO. : DS-60-07-0174 DATE : 2007-7-2 Page : 2 3.0 mm LED LAMP WITH SMH-01-LG HOLDER REV:A / 0 L-HSM002-HTS FEATURES * 3.0mm DIA LED LAMP * LOW POWER CONSUMPTION. * I.C. COMPATIBLE. * LONG LIFE SOLID STATE RELIABILITY. * Pb FREE PRODUCTS(Compliant with EU’s RoHS.) CHIP MATERIALS * Dice Material : GaP/GaP * Light Color : Green * Lens Color : Green Diffused ABSOLUTE MAXIMUM RATING : ( Ta = 25%C ) SYMBOL PAD VR IF IPF - Topr Tstg Reverse Voltage Average Forward Current(Duty=0.1,1KHZ) Peak Forward Current Per Chip (Duty=0.1,1KHz) Derating Linear From 25%C Operating Temperature Range Storage Temperature Range PARAMETER Power Dissipation Green 78 5 30 120 0.4 UNIT mW V mA mA mA/%C -25%C to 85%C -40%C to 85%C ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25%C ) SYMBOL Vf IR λd Δλ 2θ1/2 Iv DESCRIPTION Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half-Width Half Intensity Angle Luminous Intensity TEST IF=20mA VR=5 V IF=20mA IF=20mA IF=20mA IF= 20mA 568 30 60 30 MIN. TYP. 2.2 MAX. 2.6 100 UNIT V μA nm nm deg mcd DRAWING NO. : DS-60-07-0174 DATE : 2007-7-2 Page : 3 3.0 mm LED LAMP WITH SMH-01-LG HOLDER REV:A / 0 L-HSM002-HTS DRAWING NO. : DS-60-07-0174 DATE : 2007-7-2 Page : 4 3.0 mm LED LAMP WITH SMH-01-LG HOLDER REV:A / 0 L-HSM002-HTS Label Explanation PARA NO. : Refer to p13 LOT NO. : E L L 4 A B C D 7 E 0009 F A---E: For series number B---L: Local F: Foreign C---L: LAMP D---Year E---Month F---SPEC. N’W : Net Weight DRAWING NO. : DS-60-07-0174 DATE : 2007-7-2 Page : 5 3.0 mm ySOLDERING METHOD LED LAMP WITH SMH-01-LG HOLDER REV:A / 0 L-HSM002-HTS SOLDERING CONDITIONS REMARK y Solder no closer than 3mm from the DIP SOLDERING Bath temperature: 265±5℃ Immersion time: with 5 sec, 1 time base of the package y Using soldering flux,” RESIN FLUX” is recommended. yAttached data of temperatuare cure for your reference y During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260℃ or lower (To prevent heat from .


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