Ultra Low-Power FPGA Known Good Die
iCE DiCE™: iCE65L04 Ultra Low-Power FPGA Known Good Die
March 23, 2009 (1.5.3)
R
SiliconBlue
Preliminary (SUBJECT TO C...
Description
iCE DiCE™: iCE65L04 Ultra Low-Power FPGA Known Good Die
March 23, 2009 (1.5.3)
R
SiliconBlue
Preliminary (SUBJECT TO CHANGE)
Features
Figure 1: iCE65L04 Die Photo (Magnified)
First ultra low-power programmable logic
family specifically designed for hand-held applications and long battery life Less than 15 µA typical standby current (–U);
no special power down modes required Lowest active power consumption of any comparable programmable logic family Lowest heat dissipation on power-sensitive applications
www.DataSheet4U.com Known Good Die
(KGD)
Ideal for System-in-Package (SiP), stacked-die, or
multi-chip module applications
Ideal for Chip on Board (COB) mounting in low-
cost consumer products Various temperature range, thickness, and delivery method options
Reprogrammable from a variety of sources
Self-loading from secure, internal Nonvolatile
Configuration Memory (NVCM)
protection; no exposed configuration data Single-chip programmable solution Low-cost, high-volume configuration source Self-loading from external, commodity SPI serial Flash PROM
Downloaded by processor using SPI-like serial
Superior design and intellectual property (IP)
Up to 200+ MHz internal performance Flexible programmable logic and programmable
interconnect fabric Over 3,500K four-input look-up tables (LUT4) and
flip-flops Low-power logic and interconnect
On-chip, 4Kbit RAM blocks; 20 per device Flexible I/O blocks to simplify system interfaces...
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