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W3H64M72E-XSBX

Part Number	W3H64M72E-XSBX
Manufacturer	White Electronic Designs
Description	64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Published	Apr 30, 2010
Detailed Description	White Electronic Designs W3H64M72E-XSBX ADVANCED* com 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package ...
Datasheet	W3H64M72E-XSBX PDF File

Overview

White Electronic Designs W3H64M72E-XSBX ADVANCED* com 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Package: • 208 Plastic Ball Grid Array (PBGA), 17 x 23mm • 1.
0mm pitch DDR2 Data Rate = 667*, 533, 400 Core Supply Voltage = 1.
8V ± 0.
1V I/O Supply Voltage = 1.
8V ± 0.
1V - (SSTL_18 compatible) Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Eight internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) A...

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W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package - White Electronic Designs

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