DirectFET Power MOSFET
RoHs Compliant Lead-Free (Qualified up to 260°C Reflow) l Application Specific MOSFETs l Ideal for CPU Core DC-DC Conv...
Description
RoHs Compliant Lead-Free (Qualified up to 260°C Reflow) l Application Specific MOSFETs l Ideal for CPU Core DC-DC Converters l Low Conduction Losses l High Cdv/dt Immunity l Low Profile (<0.7mm) l Dual Sided Cooling Compatible l Compatible with existing Surface Mount Techniques
l l
DirectFET Power MOSFET
Typical values (unless otherwise specified)
IRF6678PbF IRF6678TRPbF
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PD - 97223
VDSS Qg
tot
VGS Qgd
15nC
RDS(on) Qgs2
4.0nC
RDS(on) Qoss
28nC
30V max ±20V max 1.7mΩ@ 10V 2.3mΩ@ 4.5V
Qrr
46nC
Vgs(th)
1.8V
43nC
MX
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details) SQ SX ST MQ MX MT
DirectFET ISOMETRIC
Description
The IRF6678PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6678PbF balances industry leading on-state resistance while minimizing gate charge along with ultra low package inductance to reduce both conduction and switching...
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