DS3174

www.DataSheet4U.com DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION The DS3171, DS3172, DS3173, and DS3174 (DS317x) combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper lines. FUNCTIONAL DIAGRAM APPLICATIONS Access Concentrators SONET/SDH ADM and Muxes PBXs Digital Cross Connect Test Equipment Routers and Switches Multiservice Access Platform (MSAP) Multiservice Protocol Platform (MSPP) PDH Multiplexer/ Demultiplexer Integrated Access Device (IAD) DS3/E3 PORTS DS3/ E3 LIU DS3/E3 FRAMER/ FORMATTER SYSTEM BACKPLANE DS317x ORDERING INFORMATION PART DS3171* DS3171N* DS3172* DS3172N* DS3173* DS3173N* DS3174 DS3174N TEMP RANGE 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C PIN-PACKAGE 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) FEATURES § § § § § § § § § § § § § Single (DS3171), Dual (DS3172), Triple (DS3173), or Quad (DS3174) Single-Chip Transceiver for DS3 and E3 All Four Devices are Pin Compatible for Ease of Port Density Migration in the Same Printed Circuit Board Platform Each Port Independently Configurable Perfo...