EMIF02-MIC03F2

EMIF02-MIC03F2 2-line IPAD™, EMI filter and ESD protection Flip-Chip package Figure 1. Pin configuration (bump side) and basic cell configuration 321 I2 I1 A GND B O2 O1 C Input Low-pass Filter GND GND Output Ri/o = 68 Ω Cline = 100 pF GND Features EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 1.07 mm x 1.47 mm Very thin package: 0.65 mm High efficiency in ESD suppression Datasheet - production data High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging Complies with the following standards: IEC 61000-4-2 level 4, on input pins – 15 kV (air discharge) – 8 kV (contact discharge) IEC 61000-4-2 Level 1, on output pins – 2 kV (air discharge) – 2 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 Application Mobile phones (differential microphone filtering and ESD protection). Description The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. TM: IPAD is a trademark of STMicroelectronics. July 2014 This is information on a product in full production. DocID11739 Rev 3 1/8 www.st.com Electrical characteristics ...