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MC2GH512DMCA-2SA00 Dataheets PDF



Part Number MC2GH512DMCA-2SA00
Manufacturers Samsung semiconductor
Logo Samsung semiconductor
Description MultiMediaCard
Datasheet MC2GH512DMCA-2SA00 DatasheetMC2GH512DMCA-2SA00 Datasheet (PDF)

Revision 0.3 TM MultiMediaCard www.DataSheet4U.com SAMSUNG MultiMediaCard Product Datasheet Version 0.3 September 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUA.

  MC2GH512DMCA-2SA00   MC2GH512DMCA-2SA00


Document
Revision 0.3 TM MultiMediaCard www.DataSheet4U.com SAMSUNG MultiMediaCard Product Datasheet Version 0.3 September 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. 1 Sep.22.2005 Revision 0.3 TM MultiMediaCard www.DataSheet4U.com Document Title SAMSUNG MultiMediaCard Revision History Revision No 0.0 History - Initial issue - Changed model number (page 5,6) - MMCmobile and MMCplus definitions were introduced. A minimum performance definition was introduced. (page 56,57) - Added new item to Spec_Vers register (page 25) - Added new item to CSD_Structure register (page 25,35) - Added new item to Extended CSD revision register (page 35) - Added Min_Performance register to EXT_CSD regiser (page 32,33) - Added 1GB Standard-Size High Speed MultiMediaCard - Added 512MB Dual Voltage Reduced-Size High Speed MultiMediaCard - Contens of Memory Array Partioning were clarified (page 8) - Several typos were corrected throughout the book - Added 2GB Standard-Size High Speed MultiMediaCard and 1GB Dual Voltage Reduced-Size High Speed MultiMediaCard Date Dec. 6. 2004 Feb. 22. 2005 Mar. 29. 2005 Remark Draft 6 Draft 7 Preliminary 0.1 0.2 July. 21. 2005 0.3 Sep. 22. 2005 The attached data sheets are prepared and approved by SAMSUNG Electronics. And SAMSUNG Electronics has the right to change all the specifications in data sheets. SAMSUNG Electronics will evaluate and reply to any dear customer‘s requests and questions on the parameters of this device. If dear customer has any questions, please call or fax to Memory Product Planning Team, or contact the SAMSUNG branch office near your office 2 Sep.22.2005 Revision 0.3 TM MultiMediaCard www.DataSheet4U.com TABLE OF CONTENTS 1. Ordering Information.................................................................................................................................. 5 2. Product Line-up......................................................................................................................................... 5 3. Introduction 3.1 General Description............................................................................................................................ 6 3.2 System Features................................................................................................................................. 6 3.3 Flash Independent Technology........................................................................................................... 7 3.4 Defect and Error Management............................................................................................................7 3.5 Endurance.......................................................................................................................................... 7 3.6 Automatic Sleep Mode........................................................................................................................ 7 3.7 Hot Insertion........................................................................................................................................7 3.8 MultiMediaCard Mode......................................................................................................................... 8 10 3.9 SPI Mode............................................................................................................................................. 4. Product Specifications 4.1 Reliability and Durability......................................................................................................................11 12 4.2 Mechanical Design and Format........................................................................................................... 5. Interface Description 15 5.1 Physical Description............................................................................................................................ 16 5.2 MultiMediaCard Bus Topology............................................................................................................. 5.3 SPI Bus Topology................................................................................................................................17 5.4 Electrical Interface..................


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