Thermal Data
SDIP 30
www.DataSheet4U.com
30 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm
molding compound
3.8 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time
September...
