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SSF3641
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DESCRIPTION
The SSF3641 uses advanced trench technology to provide excellent RDS(ON) and low gate charge .This device is suitable for use as a load switch or in PWM applications. Schematic diagram
GENERAL FEATURES
● VDS =- 30V,ID =-5A RDS(ON) < 64mΩ @ VGS=-4.5V RDS(ON) < 49mΩ @ VGS=-10V ● High Power and current handing capability ● Lead free product is acquired ● Surface Mount Package
Marking and pin Assignment
Application
●PWM applications ●Load switch ●Power management
SOP-8 top view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking SSF3641 Device SSF3641 Device Package SOP-8 Reel Size Ø330mm Tape width 12mm Quantity 2500 units
ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted) Parameter Symbol
Drain-Source Voltage Gate-Source Voltage
Limit
-30 ±12 -5 -4.2 -30 2.0 -55 To 150
Unit
V V A A A W ℃
VDS VGS ID(25℃) ID(70℃) IDM PD TJ,TSTG
Drain Current-Continuous@ Current-Pulsed (Note 1)
Maximum Power Dissipation Operating Junction and Storage Temperature Range
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2) RθJA 62.5 ℃/W
ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition
OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS VGS=0V ID=-250μA
Min
-30
Typ
Max
Unit
V
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Zero Gate Voltage Drain Current Gate-Body Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Drain-Source On-State Resistance Forward Transconductance DYNAMIC CHARACTERISTICS (Note4) Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING CHARACTERISTICS (Note 4) Turn-on Delay Time Turn-on Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge DRAIN-SOURCE DIODE CHARACTERISTICS Diode Forward Voltage (Note 3)
IDSS IGSS
VDS=-24V,VGS=0V VGS=±12V,VDS=0V
-1 ±100
μA nA
VGS(th) RDS(ON) gFS
VDS=VGS,ID=-250uA VGS=-4.5V, ID=-4A VGS=-10V, ID=-5A VDS=-5V,ID=-5A
-0.7 53 41 5
-1.3 64 49
V mΩ mΩ S
Clss Coss Crss VDS=-15V,VGS=0V, F=1.0MHz
950 100 75
PF PF PF
td(on) tr td(off) tf Qg Qgs Qgd VDS=-15V,ID=-5A,VGS=-4.5V VDS=-15V,VGS=-10V,RGEN=3Ω
12 5 36 11 9 2 3
nS nS nS nS nC nC nC
VSD
VGS=0V,IS=-1A
-0.75
-1
V
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on 1in2 FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production testing.
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TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
td(on) ton tr
90%
td(off)
toff tf
90%
VOUT
10%
INVERTED
10% 90%
VIN
10%
50%
50%
PULSE WIDTH
Figure 1: Switching Test Circuit
Figure 2:Switching Waveforms
TJ-Junction Temperature(℃)
-ID- Drain Current (A)
PD Power(W)
TJ-Junction Temperature(℃)
Figure 3 Power Dissipation
Figure 4 Drain Current
Rdson On-Resistance(mΩ)
-ID- Drain Current (A)
-Vds Drain-Source Voltage (V)
-ID- Drain Current (A)
Figure 5 Output CHARACTERISTICS
Figure 6 Drain-Source On-Resistance
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SSF3641
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-Vgs Gate-Source Voltage (V)
Normalized On-Resistance
-ID- Drain Current (A)
TJ-Junction Temperature(℃)
Figure 7 Transfer Characteristics
Figure 8 Drain-Source On-Resistance
Rdson On-Resistance(mΩ)
-Vgs Gate-Source Voltage (V)
C Capacitance (pF)
-Vds Drain-Source Voltage (V)
Figure 9 Rdson vs Vgs
Figure 10 Capacitance vs Vds
-Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
-Is- Reverse Drain Current (A)
-Vsd Source-Drain Voltage (V)
Figure 11 Gate Charge
Figure 12 Source- Drain Diode Forward
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©Silikron Semiconductor CO.,LTD.
SSF3641
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-ID- Drain Current (A)
-Vds Drain-Source Voltage (V)
Figure 13
Safe Operation Area
ZthJA Normalized Transient Thermal Resistance
Square Wave Pluse Duration(sec) Figure 14 Normalized Maximum Transient Thermal Impedance
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SSF3641
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SOP-8 PACKAGE INFORMATION
NOTES:
1. Dimensions are inclusive of plating 2. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils. 3. Dimension L is measured in gauge plane. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
©Silikron Semiconductor CO.,LTD.
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ATTENTION: ■
Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your .