SMD0805

POLYFUSE® RESETTABLE FUSES SMD0805 SMD Type, 6 V / 9 V / 15V Standard UL 1434 1st Edition CSA C22.2 No. 0 CSA TIL No. CA-3A cULus Recognition TÜV Specifications Packaging A Materials Terminals: Blistertape and reel Ø 178 mm Solder-plated copper TS: Solder Material: 63/37 SnPb TF: Solder Material: Sn Max. Device Surface Temperature in Tripped State 125 °C Operating / Storage Temperature -40 ºC to +85 ºC (consider derating) Humidity Ageing +85 °C, 85 % R.H., 1000 hours, ± 5 % typical resistance change Vibration MIL-STD-883C, Method 2007.1, Condition A, no change Thermal Shock MIL-STD-202F, Method 107G +85 °C to -40 °C 20 times, -30 % typical resistance change Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3 Reflow only Solvent Resistance MIL-STD-202, Method 215, no change Marking “P”, Part Code Approvals Features These devices offer wide range in hold currents from 0.1 A to 1.0 A and voltages from 6 V to 15 V. The SMD0805 product line is suitable for high density circuit board applications in computers, cellular phone and general electronics. Suitable for reflow soldering. Dimensions (mm) Solder pad Layout (mm) 1.2 1.5 1.0 Dimensions (mm) Model SMD0805P010TS/TF SMD0805P020TS/TF SMD0805P035TS/TF SMD0805P050TS/TF SMD0805P075TS/TF www.DataSheet4U.com SMD0805P100TS/TF 1.0 Min 2.00 2.00 2.00 2.00 2.00 2.00 A Max 2.20 2.20 2.20 2.20 2.20 2.20 Min 1.20 1.20 1.20 1.20 1.20 1.20 B Max 1.50 1.50 1.50 1.50 1.50 1.50 C Min Max 0.55 0.55 0.45 0.75 0.75...