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ESDAVLC6V1-1BM2 Dataheets PDF



Part Number ESDAVLC6V1-1BM2
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description Single line low capacitance Transil
Datasheet ESDAVLC6V1-1BM2 DatasheetESDAVLC6V1-1BM2 Datasheet (PDF)

ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 Single line low capacitance Transil™ for ESD protection Features ■ ■ ■ ■ Single line bi-directional protection Breakdown voltage VBR = 6.1 V min. Very low capacitance (6 pF typ. @ 3 V) Lead-free package Benefits ■ ■ ■ ■ Very low capacitance for optimized data integrity Very low reverse current < 0.1 µA Low PCB space consumption: 0.6 mm2 max High reliability offered by monolithic integration SOD882 SOD882T Figure 1. Functional diagram Complies with the fol.

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ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 Single line low capacitance Transil™ for ESD protection Features ■ ■ ■ ■ Single line bi-directional protection Breakdown voltage VBR = 6.1 V min. Very low capacitance (6 pF typ. @ 3 V) Lead-free package Benefits ■ ■ ■ ■ Very low capacitance for optimized data integrity Very low reverse current < 0.1 µA Low PCB space consumption: 0.6 mm2 max High reliability offered by monolithic integration SOD882 SOD882T Figure 1. Functional diagram Complies with the following standards: ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883G - Method 3015-7: class 3 B – Human body model I/O1 ■ I/O2 Applications www.DataSheet4U.com Where transient overvoltage protection in ESD sensitive equipment is required, such as: ■ ■ ■ ■ ■ Description The ESDAVLC6V1-1BM2 and ESDAVLC6V1-1BT2 are monolithic application specific devices dedicated to ESD protection of high speed serial interfaces such as USB 2.0, display and camera interface. The devices are ideal for applications where both printed circuit board space and power absorption capability are required. Computers Printers Communication systems Cellular phone handsets and accessories Video equipment TM: Transil is a trademark of STMicroelectronics April 2008 Rev 1 1/13 www.st.com Characteristics ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 1 Characteristics Table 1. Symbol VPP(1) PPP(1) IPP Tj Tstg TL TOP Absolute maximum ratings (Tamb = 25° C) Parameter IEC 61000-4-2 contact discharge Peak pulse voltage IEC 61000-4-2 air discharge MIL STD 883G - Method 3015-7: class 3B Peak pulse power dissipation (8/20 µs) Peak pulse current (8/20 µs) Junction temperature Storage temperature range Maximum lead temperature for soldering during 10 s Operating temperature range Tj initial = Tamb Value 15 15 25 30 2.5 125 - 55 to + 150 260 - 40 to + 125 Unit kV W A °C °C °C °C 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Symbol VRM VBR VCL IRM IPP Parameter www.DataSheet4U.com Electrical characteristics (Tamb = 25° C) Parameter Stand-of voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Test condition IR = 1 mA VRM = 3 V 1.6 2.5 F = 1 MHz, VR = 0 V F = 1 MHz, VR = 3 V 7 6 8 pF 7 Min 6.1 100 Typ Max Unit V nA Ω 10-4/°C VBR VRM IR IRM IRM IR VRM VBR V I VBR IRM Rd αT C 2/13 ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 Characteristics Figure 2. Relative variation of peak pulse power versus initial junction temperature Figure 3. Peak pulse power versus exponential pulse duration 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 PPP[Tj initial] / PPP[Tj initial=25°C) 1000 PPP(W) Tj initial = 25 °C 100 Tj(°C) 10 0 25 50 75 100 125 150 tp(µs) 1 10 100 Figure 4. Clamping voltage versus peak pulse current (typical values) Figure 5. Junction capacitance versus reverse voltage applied (typical values) 10.0 IPP(A) 8/20 µs Tj initial =25 °C C(pF) 8 7 6 5 F=1MHz VOSC=30mVRMS Tj=25°C 1.0 4 3 2 1 VR(V) 0 1 2 3 4 5 6 0.1 5 10 VCL(V) 15 0 Figure 6. www.DataSheet4U.com Relative variation of leakage current versus junction temperature (typical values) Figure 7. S21 attenuation measurement result S21 (dB) 10 IR[Tj] / IR[Tj=25°C] VR =3V 0.00 - 5.00 - 10.00 15.00 - 20.00 Tj(°C) 1 25 50 75 100 125 - 25.00 F (Hz) - 30.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G 3/13 Characteristics ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 Figure 8. ESD response to IEC 61000-4-2 (+2 kV air discharge) Figure 9. ESD response to IEC 61000-4-2 (-2 kV air discharge) Figure 10. ESD response to IEC 61000-4-2 (+8 kV air discharge) Figure 11. ESD response to IEC 61000-4-2 (-8 kV air discharge) Figure 12. ESD response to IEC 61000-4-2 (+15 kV air discharge) www.DataSheet4U.com Figure 13. ESD response to IEC 61000-4-2 (-15 kV air discharge) 4/13 ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 Characteristics Figure 14. ESD response to IEC 61000-4-2 (+2 kV contact discharge) Figure 15. ESD response to IEC 61000-4-2 (-2 kV contact discharge) Figure 16. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 17. ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 18. ESD response to IEC 61000-4-2 (+15 kV contact discharge) Figure 19. ESD response to IEC 61000-4-2 (-15kV contact discharge) www.DataSheet4U.com 5/13 Ordering information scheme ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 2 Ordering information scheme Figure 20. Ordering information scheme ESDA VLC 6V1 1 B x2 ESD Array Very low capacitance Breakdown voltage 6V1 = 6.1 Volts min Number of lines Directional B = Bi-directional Package M2 = SOD882 T2 = Thin SOD882 www.DataSheet4U.com 6/13 ESDAVLC6V1-1BM2, ESDAVLC6V1-1BT2 Package information 3 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is ma.


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