MUH1PB

New Product MUH1PB thru MUH1PD Vishay General Semiconductor Surface Mount Ultrafast Rectifiers FEATURES eSMP TM Series Very low profile - typical height of 0.65 mm Ideal for automated placement Oxide planar chip junction Low forward voltage drop, low leakage current Ultrafast recovery times for high frequency Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View MicroSMP PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF at IF = 1.0 A IR TJ max. 1.0 A 100 V, 150 V, 200 V 10 A 25 ns 0.82 V 1 µA 175 °C Solder dip 265 °C max. 10 s, per JESD 22-A111 Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: MicroSMP Molding compound meets UL 94 V-0 flammability rating TYPICAL APPLICATIONS For use in secondary rectification and freewheeling for ultrafast switching speeds ac-to-ac and dc-to-dc converters for commercial applications. www.DataSheet4U.com Base P/N-M3 - halogen-free and RoHS compliant, commercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 1A whisker test Polarity: Color band denotes the cathode end MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER Device marking code Maximum repetitive peak reverse voltage Maximum average forward rectified current (fig. 1) Peak forward surge current 10 ms single half sine-wave superimposed on rated load Operatin...